頁 9 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件

零件編號	製造商	描述	封裝	庫存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
28-651000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 28DIP 0.6 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,906	DIP, 0.6" (15.24mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
56-184M65	Aries Electronics	SOCKET ADAPTER QFP TO 184PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 184 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存6,912	PGA	184	-	-	-	-	-	-	-	-
44-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 44DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,766	DIP, 0.6" (15.24mm) Row Spacing	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-80C251	Aries Electronics	SOCKET ADAPTER DIP TO PLCC Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存5,166	-	-	-	-	-	-	-	-	-	-
242-1293-29-0602J	3M	RECEPTACLE DIP SOCKET 42POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,500	-	-	-	-	-	-	-	-	-	-
96-160M65	Aries Electronics	SOCKET ADAPTER QFP TO 160PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 160 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,604	PGA	160	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
32-652000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,006	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
28-352000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,860	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-650000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,526	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
28-651000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 28DIP 0.6 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,732	DIP, 0.6" (15.24mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-450001-10	Aries Electronics	SOCKET ADAPTER SOJ TO 28DIP 0.4 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,372	DIP, 0.4" (10.16mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	FR4 Epoxy Glass
18-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 18SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存3,798	SOIC	18	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
18-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 18SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存7,002	SOIC	18	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 16SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存6,336	SOIC	16	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 24DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,830	DIP, 0.3" (7.62mm) Row Spacing	24	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
1111903	Aries Electronics	SOCKET ADAPT SOWIC TO 24DIP 0.4 Convert From (Adapter End): SOWIC Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,920	DIP, 0.4" (10.16mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1106396-40	Aries Electronics	SOCKET ADAPTER DIP TO 40DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存4,374	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 20SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,474	SOWIC	20	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
12-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 12SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,286	SOWIC	12	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
LCQT-QFP0.8-80	Aries Electronics	SOCKET ADAPTER MULT PKG TO 80QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 80 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存6,786	QFP	80	0.031" (0.80mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
44-505-110-P	Aries Electronics	SOCKET ADAPTER PLCC TO 44PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,770	PGA	44	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-350002-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,490	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
12-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 12DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存8,874	DIP, 0.3" (7.62mm) Row Spacing	12	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
222-3343-19-0602J	3M	RECEPTACLE DIP SOCKET 22POS .4" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,200	-	-	-	-	-	-	-	-	-	-
18-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存7,056	DIP, 0.3" (7.62mm) Row Spacing	18	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
PA-QSD3SM18-16	Logical Systems Inc.	ADAPTER 16QSOP TO 16DIP Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,254	-	-	-	-	-	-	-	-	-	-
16-665000-00	Aries Electronics	SCK ADAPT 16P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,914	SOIC	16	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
216-3340-09-0602J	3M	SOCKET ADAPTER 16DIP TO 16DIP Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存7,614	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
28-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,830	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
16-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 16DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存7,656	DIP, 0.3" (7.62mm) Row Spacing	16	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)

28-651000-11-RC

Aries Electronics

SOCKET ADAPTER SSOP TO 28DIP 0.6

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,906

DIP, 0.6" (15.24mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

56-184M65

Aries Electronics

SOCKET ADAPTER QFP TO 184PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 184
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存6,912

PGA

184

-

44-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,766

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

97-80C251

Aries Electronics

SOCKET ADAPTER DIP TO PLCC

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存5,166

-

242-1293-29-0602J

3M

RECEPTACLE DIP SOCKET 42POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,500

-

96-160M65

Aries Electronics

SOCKET ADAPTER QFP TO 160PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 160
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,604

PGA

160

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

32-652000-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,006

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

28-352000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.3

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,860

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

28-650000-11-RC-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,526

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

28-651000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 28DIP 0.6

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,732

DIP, 0.6" (15.24mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

28-450001-10

Aries Electronics

SOCKET ADAPTER SOJ TO 28DIP 0.4

Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,372

DIP, 0.4" (10.16mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

FR4 Epoxy Glass

18-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 18
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存3,798

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

18-354000-11-RC

Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 18
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存7,002

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

16-354000-11-RC

Aries Electronics

SOCKET ADAPTER DIP TO 16SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存6,336

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

24-351000-11-RC

Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,830

DIP, 0.3" (7.62mm) Row Spacing

24

0.026" (0.65mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

1111903

Aries Electronics

SOCKET ADAPT SOWIC TO 24DIP 0.4

Convert From (Adapter End): SOWIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,920

DIP, 0.4" (10.16mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1106396-40

Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存4,374

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

20-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 20SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,474

SOWIC

20

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

12-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 12SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 12
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,286

SOWIC

12

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

LCQT-QFP0.8-80

Aries Electronics

SOCKET ADAPTER MULT PKG TO 80QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 80
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,786

QFP

80

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

44-505-110-P

Aries Electronics

SOCKET ADAPTER PLCC TO 44PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,770

PGA

44

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

28-350002-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,490

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

12-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 12DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 12
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存8,874

DIP, 0.3" (7.62mm) Row Spacing

12

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

222-3343-19-0602J

3M

RECEPTACLE DIP SOCKET 22POS .4"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,200

-

18-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存7,056

DIP, 0.3" (7.62mm) Row Spacing

18

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

PA-QSD3SM18-16

Logical Systems Inc.

ADAPTER 16QSOP TO 16DIP

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,254

-

16-665000-00

Aries Electronics

SCK ADAPT 16P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,914

SOIC

16

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

216-3340-09-0602J

3M

SOCKET ADAPTER 16DIP TO 16DIP

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存7,614

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

28-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,830

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

16-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存7,656

DIP, 0.3" (7.62mm) Row Spacing

16

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)