頁 4 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0723-02M	Trenz Electronic GmbH	SOM ARDUZYNQ 7Z10 USBOTG MICROSD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 12MHz Flash Size: 16MB RAM Size: 512MB Connector Type: Arduino Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,816	ARM Cortex-A9	Zynq-7000 (Z-7010)	12MHz	16MB	512MB	Arduino	-	0°C ~ 70°C
CC-9C-V226-Z1	Digi International	MODULE 9C 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 64MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,560	ARM926EJ-S, NS9360	-	155MHz	64MB	32MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-9P-V502-ZA-C	Digi International	MODULE 9P 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,440	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
101-0674	Digi International	MODULE RABBITCORE RCM3700 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,752	Rabbit 3000	-	22.1MHz	512KB	512KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	0°C ~ 70°C
TE0728-03-1Q	Trenz Electronic GmbH	SOM XA7Z020-1CLG484Q 512MB CAN Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: Samtec SEM Size / Dimension: 2.36" x 2.36" (60mm x 60mm) Operating Temperature: -	封裝: -	庫存4,640	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	16MB	512MB	Samtec SEM	2.36" x 2.36" (60mm x 60mm)	-
CENGPXA270-416-11-505EXR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 416MHz Flash Size: 64MB RAM Size: 64MB Connector Type: Edge Connector Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -25°C ~ 85°C	封裝: -	庫存3,008	PXA270	-	416MHz	64MB	64MB	Edge Connector	2.37" x 2.67" (60.2mm x 67.8mm)	-25°C ~ 85°C
EDM1-IMX6Q-MSD-BW	Wandboard.Org	EDM1-IMX6Q-MSD-BW SOM 10PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,248	-	-	-	-	-	-	-	-
TE0711-01-35-2I	Trenz Electronic GmbH	SOM ARTIX-7 HIGH IO 35T USB 2I Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,088	Artix-7 A35T	-	100MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DC-ME-01T-NS	Digi International	MODULE ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,848	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
1810-DX-225-RC	Critical Link LLC	MITYDSP-1810 SOM OMAP-L138 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1810 Co-Processor: - Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,152	ARM926EJ-S, AM1810	-	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal), 128MB (External)	SO-DIMM-200	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
20-101-0081	Digi International	CORE MODULE CM7100 Module/Board Type: MPU Core Core Processor: Z180 Co-Processor: - Speed: 18.432MHz Flash Size: 512KB EPROM RAM Size: 128KB Connector Type: 40 Pin Header Size / Dimension: 1.8" x 2.05" (46mm x 52mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存6,348	Z180	-	18.432MHz	512KB EPROM	128KB	40 Pin Header	1.8" x 2.05" (46mm x 52mm)	-40°C ~ 70°C
EZ80L925148MODG	Zilog	MCU MODULE 8MB FLASH 100LQFP Module/Board Type: MCU Core Core Processor: eZ80L92 Co-Processor: - Speed: 48MHz Flash Size: 8MB RAM Size: 512KB Connector Type: Header 2x25 Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	庫存8,064	eZ80L92	-	48MHz	8MB	512KB	Header 2x25	-	0°C ~ 70°C
20-101-0494	Digi International	MODULE RABBITCORE RCM2250 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存10,056	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
TE0725LP-01-72C-1U	Trenz Electronic GmbH	IC MOD ARTIX-7 A100T 25MHZ 64MB Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 25MHz Flash Size: 64MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,472	Artix-7 A100T	-	25MHz	64MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
TE0712-02-82C36-L	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
ME-XU8-4CG-1I-D11E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU4CG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
2DC-VA-H264-10B-30-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD H264 DEC 30FPS 1080 SODIMM Module/Board Type: DSP, FPGA Core Core Processor: - Co-Processor: Xilinx Artix-7 XC7A200T Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: SO-DIMM Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	Xilinx Artix-7 XC7A200T	-	32MB	512MB	SO-DIMM	-	-
M100PF-2AC	ARIES Embedded	SOM POLARFIRE FPGA MPF200T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	-	-	-	-	1GB	Board-to-Board (BTB) Socket	-	0°C ~ 70°C
CC-MX-FR6D-ZN	Digi	CONNECTCORE 8M NANO, SOLOLITE, 8 Module/Board Type: MCU Core Core Processor: ARM® Cortex®-A53 Co-Processor: ARM® Cortex®-M7 Speed: 600MHz, 1.4GHz Flash Size: - RAM Size: 512MB Connector Type: USB Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53	ARM® Cortex®-M7	600MHz, 1.4GHz	-	512MB	USB	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
TE0600-04-83I11-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX150-3FGG484I Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX150-3FGG484I	-	125MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-05-51I33-L	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ XC7Z Module/Board Type: MPU Core Core Processor: Zynq™ 7015 XC7Z015-1CLG485I Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq™ 7015 XC7Z015-1CLG485I	ARM Cortex-A9	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-03-91C31-A	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-1C, 1 GBY Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-1FBG676C Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-1FBG676C	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 70°C
ME-AA1-480-2I3-D12E-R2	Enclustra FPGA Solutions	SOM ARRIA 10 10AS048 4GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: - Speed: 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Dual-Core Cortex-A9	-	1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0820-05-3BE21MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
L138-DG-325-RI-CR	Critical Link LLC	MOD MITYDSP-L138F OMAP-L138, FPG Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) Speed: 375MHz Flash Size: 256MB (NAND), 16MB (NOR) RAM Size: 8kB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)	375MHz	256MB (NAND), 16MB (NOR)	8kB (Internal), 128MB (External)	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	-40°C ~ 85°C
TE0712-03-82I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-2FBG484I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Artix-7 XC7A200T-2FBG484I	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0720-03-2IFC1	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
DC-VA-H264-10B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C

TE0723-02M

Trenz Electronic GmbH

SOM ARDUZYNQ 7Z10 USBOTG MICROSD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 12MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: Arduino
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,816

ARM Cortex-A9

Zynq-7000 (Z-7010)

12MHz

16MB

512MB

Arduino

-

0°C ~ 70°C

CC-9C-V226-Z1

Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 64MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,560

ARM926EJ-S, NS9360

-

155MHz

64MB

32MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CC-9P-V502-ZA-C

Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,440

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

101-0674

Digi International

MODULE RABBITCORE RCM3700

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,752

Rabbit 3000

-

22.1MHz

512KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

0°C ~ 70°C

TE0728-03-1Q

Trenz Electronic GmbH

SOM XA7Z020-1CLG484Q 512MB CAN

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: Samtec SEM
Size / Dimension: 2.36" x 2.36" (60mm x 60mm)
Operating Temperature: -

封裝: -

庫存4,640

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

16MB

512MB

Samtec SEM

2.36" x 2.36" (60mm x 60mm)

-

CENGPXA270-416-11-505EXR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 416MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: Edge Connector
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -25°C ~ 85°C

封裝: -

庫存3,008

PXA270

-

416MHz

64MB

Edge Connector

2.37" x 2.67" (60.2mm x 67.8mm)

-25°C ~ 85°C

EDM1-IMX6Q-MSD-BW

Wandboard.Org

EDM1-IMX6Q-MSD-BW SOM 10PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,248

-

TE0711-01-35-2I

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 35T USB 2I

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,088

Artix-7 A35T

-

100MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DC-ME-01T-NS

Digi International

MODULE ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,848

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

1810-DX-225-RC

Critical Link LLC

MITYDSP-1810 SOM OMAP-L138

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1810
Co-Processor: -
Speed: 375MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,152

ARM926EJ-S, AM1810

-

375MHz

256MB (NAND), 8MB (NOR)

8KB (Internal), 128MB (External)

SO-DIMM-200

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

20-101-0081

Digi International

CORE MODULE CM7100

Module/Board Type: MPU Core
Core Processor: Z180
Co-Processor: -
Speed: 18.432MHz
Flash Size: 512KB EPROM
RAM Size: 128KB
Connector Type: 40 Pin Header
Size / Dimension: 1.8" x 2.05" (46mm x 52mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存6,348

Z180

-

18.432MHz

512KB EPROM

128KB

40 Pin Header

1.8" x 2.05" (46mm x 52mm)

-40°C ~ 70°C

EZ80L925148MODG

Zilog

MCU MODULE 8MB FLASH 100LQFP

Module/Board Type: MCU Core
Core Processor: eZ80L92
Co-Processor: -
Speed: 48MHz
Flash Size: 8MB
RAM Size: 512KB
Connector Type: Header 2x25
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存8,064

eZ80L92

-

48MHz

8MB

512KB

Header 2x25

-

0°C ~ 70°C

20-101-0494

Digi International

MODULE RABBITCORE RCM2250

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存10,056

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

TE0725LP-01-72C-1U

Trenz Electronic GmbH

IC MOD ARTIX-7 A100T 25MHZ 64MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 25MHz
Flash Size: 64MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,472

Artix-7 A100T

-

25MHz

64MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

0°C ~ 70°C

TE0712-02-82C36-L

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

ME-XU8-4CG-1I-D11E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU4CG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

2DC-VA-H264-10B-30-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD H264 DEC 30FPS 1080 SODIMM

Module/Board Type: DSP, FPGA Core
Core Processor: -
Co-Processor: Xilinx Artix-7 XC7A200T
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: SO-DIMM
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

Xilinx Artix-7 XC7A200T

-

32MB

512MB

SO-DIMM

-

M100PF-2AC

ARIES Embedded

SOM POLARFIRE FPGA MPF200T

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

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-

1GB

Board-to-Board (BTB) Socket

-

0°C ~ 70°C

CC-MX-FR6D-ZN

Digi

CONNECTCORE 8M NANO, SOLOLITE, 8

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: ARM® Cortex®-M7
Speed: 600MHz, 1.4GHz
Flash Size: -
RAM Size: 512MB
Connector Type: USB
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53

ARM® Cortex®-M7

600MHz, 1.4GHz

-

512MB

USB

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

TE0600-04-83I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX150-3FGG484I
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Spartan™ 6 XC6SLX150-3FGG484I

-

125MHz

16MB

128MB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0715-05-51I33-L

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

Module/Board Type: MPU Core
Core Processor: Zynq™ 7015 XC7Z015-1CLG485I
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq™ 7015 XC7Z015-1CLG485I

ARM Cortex-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-03-91C31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-1C, 1 GBY

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-1FBG676C
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A9

Xilinx Zynq 7045 SoC XC7Z045-1FBG676C

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 70°C

ME-AA1-480-2I3-D12E-R2

Enclustra FPGA Solutions

SOM ARRIA 10 10AS048 4GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: -
Speed: 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Dual-Core Cortex-A9

-

1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0820-05-3BE21MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

L138-DG-325-RI-CR

Critical Link LLC

MOD MITYDSP-L138F OMAP-L138, FPG

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
Speed: 375MHz
Flash Size: 256MB (NAND), 16MB (NOR)
RAM Size: 8kB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)

375MHz

256MB (NAND), 16MB (NOR)

8kB (Internal), 128MB (External)

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

-40°C ~ 85°C

TE0712-03-82I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-2FBG484I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Artix-7 XC7A200T-2FBG484I

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0720-03-2IFC1

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

4GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

DC-VA-H264-10B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C