圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
IC DRIVER ISO 9141 8SOIC
|
封裝: - |
庫存4,880 |
|
- | - | - | - | - | - | - | - |
|
|
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
封裝: 16-SOIC (0.295", 7.50mm Width) |
庫存6,976 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
Texas Instruments |
IC PROG SENSOR
|
封裝: Die |
庫存5,168 |
|
Voltage | Voltage | UART | 1.6mA | 0°C ~ 70°C | Surface Mount | Die | Die |
|
|
Texas Instruments |
IC 4-20MA TRANSMITTER 16-SOIC
|
封裝: 16-SOIC (0.295", 7.50mm Width) |
庫存5,200 |
|
Differential | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
Texas Instruments |
IC CRNT TRANSMITTER WAFFLE PACK
|
封裝: Die |
庫存3,200 |
|
Voltage | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | - | Die | - |
|
|
|
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
封裝: - |
庫存4,176 |
|
- | - | - | 2.1mA | -40°C ~ 125°C | - | - | - |
|
|
|
Melexis Technologies NV |
IC OPTICAL PROXIMITY
|
封裝: - |
庫存4,512 |
|
- | - | - | - | - | - | - | - |
|
|
Analog Devices Inc. |
IC THRMOCPLE COLD JNC COMP 8MSOP
|
封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
庫存7,792 |
|
Differential | Analog | - | 250µA | 0°C ~ 50°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
|
|
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存7,744 |
|
Thermocouple (J) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Maxim Integrated |
IC TRANSLATOR/SERIALIZER 28TSSOP
|
封裝: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
庫存4,416 |
|
Analog | Digital | SPI | 1.4mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-TSSOP-EP |
|
|
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16DIP
|
封裝: 16-DIP (0.300", 7.62mm) |
庫存2,100 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
封裝: 16-SOIC (0.154", 3.90mm Width) |
庫存3,600 |
|
Photoelectric | Voltage | - | 4µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
Microchip Technology |
IC HORN DRIVER DUAL 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存54,000 |
|
Logic | Logic | Logic | 4µA | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存253,860 |
|
Thermocouple (Multiple) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Texas Instruments |
IC KNOCK SENSOR INTERFACE 20SOIC
|
封裝: 20-SOIC (0.295", 7.50mm Width) |
庫存109,788 |
|
Serial | Serial | SPI | 20mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Texas Instruments |
IC TX 4-20MA CURR-LOOP 8SON
|
封裝: 8-VDFN Exposed Pad |
庫存6,688 |
|
Voltage | Voltage | 2-Wire | 20mA | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-SON (3x3) |
|
|
Maxim Integrated |
4-20MA ANALOG BACKEND
|
封裝: 32-WFQFN Exposed Pad |
庫存6,368 |
|
Voltage | Voltage | 3-Wire | - | -40°C ~ 125°C | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
|
|
Microchip Technology |
THERMOCOUPLE I2C CONVERTER
|
封裝: 20-VQFN Exposed Pad |
庫存19,020 |
|
Thermocouple | I²C | - | 2.5mA | -40°C ~ 125°C (TA) | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
封裝: - |
Request a Quote |
|
Analog | 1-Wire®, I2C | - | 7 mA | -40°C ~ 150°C (TA) | Surface Mount | Die | Die |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
封裝: - |
Request a Quote |
|
Analog | 1-Wire®, I2C | - | 7 mA | -40°C ~ 150°C (TA) | Surface Mount | Die | Die |
|
|
|
ScioSense |
TDC-GPX2 QFN64 TRA
|
封裝: - |
Request a Quote |
|
CMOS, LVDS | LVDS, Serial, SPI | - | 100 µA | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | 64-QFP (10x10) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
WAFER (SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
TSSOP / 16 / 5X4MM-0
|
封裝: - |
Request a Quote |
|
Differential | 1-Wire® | - | - | -40°C ~ 150°C | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
|
|
|
Microchip Technology |
E-CAL ION SMOKE DETECTOR
|
封裝: - |
庫存2,154 |
|
Ionization | - | - | 5.3 µA | -10°C ~ 60°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
