頁 2 - NXP 產品 - 介面 - 專用

零件編號	製造商	描述	封裝	庫存	Interface	Voltage - Supply	Package / Case	Supplier Device Package	Mounting Type
MCZ33904D3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存2,528	CAN	5.5 V ~ 28 V	-	-	-
MCZ33903DP5EK	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存4,608	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903DP3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存6,320	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33905DD5EKR2	NXP	SYSTEM BASIS CHIP 2 LIN 2X 5.0 Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存3,136	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33905DD3EKR2	NXP	SYSTEM BASIS CHIP 2 LIN 2X 3.3 Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存4,688	CAN, LIN	5.5 V ~ 28 V	-	-	-
TDA8026ET/C3E	NXP	MULTIPLE SMART CARD SLOT INTERFA Applications: - Interface: I²C Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA Mounting Type: Surface Mount	封裝: 64-TFBGA	庫存5,408	I²C	2.7 V ~ 5.5 V	64-TFBGA	64-TFBGA	Surface Mount
MCZ33903DD5EKR2	NXP	SYSTEM BASIS CHIP 2 LIN 2X 5.0 Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存3,536	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903DD3EKR2	NXP	SYSTEM BASIS CHIP 2 LIN 2X 3.3 Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存3,920	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33905DS5EKR2	NXP	SYSTEM BASIS CHIP LIN 2X 5.0 V Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存5,472	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33905DS3EKR2	NXP	SYSTEM BASIS CHIP LIN 2X 3.3 V Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存3,248	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903DS5EKR2	NXP	SYSTEM BASIS CHIPLIN 2X 5.0 V/ Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存2,128	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903DS3EKR2	NXP	SYSTEM BASIS CHIP LIN 2X 3.3 V Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存6,848	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903D5EKR2	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存7,152	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903D3EKR2	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存3,248	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33904D5EKR2	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存2,112	CAN	5.5 V ~ 28 V	-	-	-
MCZ33904D3EKR2	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存7,760	CAN	5.5 V ~ 28 V	-	-	-
MCZ33903DP5EKR2	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存5,392	CAN, LIN	5.5 V ~ 28 V	-	-	-
MCZ33903DP3EKR2	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存6,000	CAN, LIN	5.5 V ~ 28 V	-	-	-
MC33CD1030AER2	NXP	SWITCH DETECT INTERFACE 33 CHAN Applications: Switch Monitoring Interface: SPI Voltage - Supply: 4.5 V ~ 36 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存2,688	SPI	4.5 V ~ 36 V	-	-	-
TDA8026ET/C3Y	NXP	MULTIPLE SMART CARD SLOT INTERFA Applications: - Interface: I²C Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (7x7) Mounting Type: Surface Mount	封裝: 64-TFBGA	庫存5,760	I²C	2.7 V ~ 5.5 V	64-TFBGA	64-TFBGA (7x7)	Surface Mount
TDA8026ET/C3K	NXP	MULTIPLE SMART CARD SLOT INTERFA Applications: - Interface: I²C Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA Mounting Type: Surface Mount	封裝: 64-TFBGA	庫存5,680	I²C	2.7 V ~ 5.5 V	64-TFBGA	64-TFBGA	Surface Mount
TJA1081GTS/0Z	NXP	FLEXRAY NODE TRANSCEIVER Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存4,288	-	-	-	-	-
MC33660BEF	NXP	TRANSCEIVER PHYSICAL LAYER ISO Applications: Automotive Interface: Serial Link Bus Interface Voltage - Supply: 8 V ~ 18 V Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC Mounting Type: Surface Mount	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存6,304	Serial Link Bus Interface	8 V ~ 18 V	8-SOIC (0.154", 3.90mm Width)	8-SOIC	Surface Mount
UJA1169LTK/X/FZ	NXP	MINI HIGH-SPEED CAN COMPANION SY Applications: System Basis Chip Interface: CAN Voltage - Supply: 5V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存7,280	CAN	5V	-	-	-
UJA1169TK/X/FZ	NXP	IC TRANSCEIVER Applications: System Basis Chip Interface: CAN Voltage - Supply: 5V Package / Case: - Supplier Device Package: 20-HVSON (3.5x5.5) Mounting Type: Surface Mount	封裝: -	庫存3,936	CAN	5V	-	20-HVSON (3.5x5.5)	Surface Mount
UJA1079ATW/5V0/WDJ	NXP	IC SBC LIN Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存6,400	SPI Serial	4.5 V ~ 28 V	32-TSSOP (0.240", 6.10mm Width) Exposed Pad	32-HTSSOP	Surface Mount
UJA1079ATW/3V3/WDJ	NXP	IC SBC LIN Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存7,136	SPI Serial	4.5 V ~ 28 V	32-TSSOP (0.240", 6.10mm Width) Exposed Pad	32-HTSSOP	Surface Mount
UJA1169LTK/FZ	NXP	MINI HIGH-SPEED CAN COMPANION SY Applications: System Basis Chip Interface: CAN Voltage - Supply: 5V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存4,816	CAN	5V	-	-	-
UJA1169TK/F/3Z	NXP	MINI HIGH-SPEED CAN SYSTEM BASIS Applications: System Basis Chip Interface: CAN Voltage - Supply: 5V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存5,840	CAN	5V	-	-	-
UJA1169TK/FZ	NXP	IC TRANSCEIVER Applications: System Basis Chip Interface: CAN Voltage - Supply: 5V Package / Case: - Supplier Device Package: 20-HVSON (3.5x5.5) Mounting Type: Surface Mount	封裝: -	庫存5,056	CAN	5V	-	20-HVSON (3.5x5.5)	Surface Mount

MCZ33904D3EK

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存2,528

CAN

5.5 V ~ 28 V

-

MCZ33903DP5EK

NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存4,608

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903DP3EK

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存6,320

CAN, LIN

5.5 V ~ 28 V

-

MCZ33905DD5EKR2

NXP

SYSTEM BASIS CHIP 2 LIN 2X 5.0

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存3,136

CAN, LIN

5.5 V ~ 28 V

-

MCZ33905DD3EKR2

NXP

SYSTEM BASIS CHIP 2 LIN 2X 3.3

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存4,688

CAN, LIN

5.5 V ~ 28 V

-

TDA8026ET/C3E

NXP

MULTIPLE SMART CARD SLOT INTERFA

Applications: -
Interface: I²C
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA
Mounting Type: Surface Mount

封裝: 64-TFBGA

庫存5,408

I²C

2.7 V ~ 5.5 V

64-TFBGA

Surface Mount

MCZ33903DD5EKR2

NXP

SYSTEM BASIS CHIP 2 LIN 2X 5.0

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存3,536

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903DD3EKR2

NXP

SYSTEM BASIS CHIP 2 LIN 2X 3.3

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存3,920

CAN, LIN

5.5 V ~ 28 V

-

MCZ33905DS5EKR2

NXP

SYSTEM BASIS CHIP LIN 2X 5.0 V

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存5,472

CAN, LIN

5.5 V ~ 28 V

-

MCZ33905DS3EKR2

NXP

SYSTEM BASIS CHIP LIN 2X 3.3 V

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存3,248

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903DS5EKR2

NXP

SYSTEM BASIS CHIPLIN 2X 5.0 V/

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存2,128

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903DS3EKR2

NXP

SYSTEM BASIS CHIP LIN 2X 3.3 V

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存6,848

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903D5EKR2

NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存7,152

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903D3EKR2

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存3,248

CAN, LIN

5.5 V ~ 28 V

-

MCZ33904D5EKR2

NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存2,112

CAN

5.5 V ~ 28 V

-

MCZ33904D3EKR2

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存7,760

CAN

5.5 V ~ 28 V

-

MCZ33903DP5EKR2

NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存5,392

CAN, LIN

5.5 V ~ 28 V

-

MCZ33903DP3EKR2

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存6,000

CAN, LIN

5.5 V ~ 28 V

-

MC33CD1030AER2

NXP

SWITCH DETECT INTERFACE 33 CHAN

Applications: Switch Monitoring
Interface: SPI
Voltage - Supply: 4.5 V ~ 36 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存2,688

SPI

4.5 V ~ 36 V

-

TDA8026ET/C3Y

NXP

MULTIPLE SMART CARD SLOT INTERFA

Applications: -
Interface: I²C
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (7x7)
Mounting Type: Surface Mount

封裝: 64-TFBGA

庫存5,760

I²C

2.7 V ~ 5.5 V

64-TFBGA

64-TFBGA (7x7)

Surface Mount

TDA8026ET/C3K

NXP

MULTIPLE SMART CARD SLOT INTERFA

Applications: -
Interface: I²C
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA
Mounting Type: Surface Mount

封裝: 64-TFBGA

庫存5,680

I²C

2.7 V ~ 5.5 V

64-TFBGA

Surface Mount

TJA1081GTS/0Z

NXP

FLEXRAY NODE TRANSCEIVER

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存4,288

-

MC33660BEF

NXP

TRANSCEIVER PHYSICAL LAYER ISO

Applications: Automotive
Interface: Serial Link Bus Interface
Voltage - Supply: 8 V ~ 18 V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC
Mounting Type: Surface Mount

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存6,304

Serial Link Bus Interface

8 V ~ 18 V

8-SOIC (0.154", 3.90mm Width)

8-SOIC

Surface Mount

UJA1169LTK/X/FZ

NXP

MINI HIGH-SPEED CAN COMPANION SY

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存7,280

CAN

5V

-

UJA1169TK/X/FZ

NXP

IC TRANSCEIVER

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5V
Package / Case: -
Supplier Device Package: 20-HVSON (3.5x5.5)
Mounting Type: Surface Mount

封裝: -

庫存3,936

CAN

5V

-

20-HVSON (3.5x5.5)

Surface Mount

UJA1079ATW/5V0/WDJ

NXP

IC SBC LIN

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存6,400

SPI Serial

4.5 V ~ 28 V

32-TSSOP (0.240", 6.10mm Width) Exposed Pad

32-HTSSOP

Surface Mount

UJA1079ATW/3V3/WDJ

NXP

IC SBC LIN

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存7,136

SPI Serial

4.5 V ~ 28 V

32-TSSOP (0.240", 6.10mm Width) Exposed Pad

32-HTSSOP

Surface Mount

UJA1169LTK/FZ

NXP

MINI HIGH-SPEED CAN COMPANION SY

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存4,816

CAN

5V

-

UJA1169TK/F/3Z

NXP

MINI HIGH-SPEED CAN SYSTEM BASIS

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存5,840

CAN

5V

-

UJA1169TK/FZ

NXP

IC TRANSCEIVER

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5V
Package / Case: -
Supplier Device Package: 20-HVSON (3.5x5.5)
Mounting Type: Surface Mount

封裝: -

庫存5,056

CAN

5V

-

20-HVSON (3.5x5.5)

Surface Mount