頁 8 - NXP 產品 - PMIC - 電源管理 - 專用

零件編號	製造商	描述	封裝	庫存	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MPF5200AMMG0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-PowerWFQFN Supplier Device Package: 32-HWQFN (5x5)	封裝: -	Request a Quote	-	-	-	Surface Mount, Wettable Flank	32-PowerWFQFN	32-HWQFN (5x5)
MVR5510AMDAHESR2	NXP	IC PMIC VR5510 ASIL-D Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	2.7V ~ 60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8400G0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MWCT1016SFVMH	NXP	WCT1016 100MAPBGA Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	封裝: -	Request a Quote	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount	100-LFBGA	100-MAPBGA (11x11)
MVR5510AMDANES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33VR5500V3ESR2	NXP	VR5500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	-	-	-	-	-	-
MC33FS6525KAER2	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MVR5510AMDALES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MPF5032BMBA0ESR2	NXP	PMIC 2 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	封裝: -	Request a Quote	-	3.3V ~ 5.25V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-PowerVFQFN	40-HVQFN (6x6)
MC34PF4210A2ES	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	封裝: -	Request a Quote	-	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MPF5023AMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 200µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: -	Request a Quote	200µA	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MFS2620AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC34PF4210A3ES	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	封裝: -	Request a Quote	-	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MC34PF4210A4ES	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	封裝: -	Request a Quote	-	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MC35FS6505NAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS8425G0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS2613AMDDCAD	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: - Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: -	Request a Quote	-	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC34PF8100CCEPR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC35FS6516CAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS8405G0KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MWCT1016SFVMHN	NXP	WCT1016 100MAPBGA Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	封裝: -	Request a Quote	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount	100-LFBGA	100-MAPBGA (11x11)
MC33FS6508CAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MFS2300BMMA0EPR2	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	-	-	-	-	-	-
MFS2611AMBA0AD	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MFS2633AMDA0ADR2	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: 29µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: -	Request a Quote	29µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33FS8410G0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MPF7100BVBA0ESR2	NXP	POWER MANAGEMENT IC, I.MX 8, I.M Applications: i.MX Processors Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封裝: -	Request a Quote	10µA	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MC33PF8200CLESR2	NXP	PF8200 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)

MPF5200AMMG0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-PowerWFQFN
Supplier Device Package: 32-HWQFN (5x5)

封裝: -

Request a Quote

-

Surface Mount, Wettable Flank

32-PowerWFQFN

32-HWQFN (5x5)

MVR5510AMDAHESR2

NXP

IC PMIC VR5510 ASIL-D

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

15mA

2.7V ~ 60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8400G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MWCT1016SFVMH

NXP

WCT1016 100MAPBGA

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封裝: -

Request a Quote

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount

100-LFBGA

100-MAPBGA (11x11)

MVR5510AMDANES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33VR5500V3ESR2

NXP

VR5500

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

-

MC33FS6525KAER2

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MVR5510AMDALES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MPF5032BMBA0ESR2

NXP

PMIC 2 BUCKS 2 LDO A1 DIE

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 3.3V ~ 5.25V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Supplier Device Package: 40-HVQFN (6x6)

封裝: -

Request a Quote

-

3.3V ~ 5.25V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-PowerVFQFN

40-HVQFN (6x6)

MC34PF4210A2ES

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

封裝: -

Request a Quote

-

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MPF5023AMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: -

Request a Quote

200µA

2.5V ~ 5.5V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-VFQFN Exposed Pad

40-HVQFN (6x6)

MFS2620AMDA0ADR2

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

Request a Quote

30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC34PF4210A3ES

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

封裝: -

Request a Quote

-

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MC34PF4210A4ES

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

封裝: -

Request a Quote

-

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MC35FS6505NAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS8425G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS2613AMDDCAD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: -
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

Request a Quote

-

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC34PF8100CCEPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC35FS6516CAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS8405G0KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MWCT1016SFVMHN

NXP

WCT1016 100MAPBGA

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封裝: -

Request a Quote

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount

100-LFBGA

100-MAPBGA (11x11)

MC33FS6508CAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MFS2300BMMA0EPR2

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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-

MFS2611AMBA0AD

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

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30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MFS2633AMDA0ADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

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29µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC33FS8410G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MPF7100BVBA0ESR2

NXP

POWER MANAGEMENT IC, I.MX 8, I.M

Applications: i.MX Processors
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封裝: -

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10µA

2.5V ~ 5.5V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MC33PF8200CLESR2

NXP

PF8200

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)