頁 3 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF6VP121KHR5	NXP	FET RF 2CH 110V 1.03GHZ NI1230H Transistor Type: LDMOS (Dual) Frequency: 1.03GHz Gain: 20dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 150mA Power - Output: 1000W Voltage - Rated: 110V Package / Case: NI-1230 Supplier Device Package: NI-1230	封裝: NI-1230	庫存4,784
LD6835K/18HX	NXP	IC REG LINEAR 1.8V 300MA 4HXSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V Voltage - Output (Max): - Voltage Dropout (Max): 0.24V @ 300mA (Typ) Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 75µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XDFN Exposed Pad Supplier Device Package: 4-HXSON (1x1)	封裝: 4-XDFN Exposed Pad	庫存5,968
TZA3047BVH/C1,557	NXP	IC LASER DRIVER 1.25GBPS 32-HBCC Type: Laser Diode Driver (Fiber Optic) Data Rate: 1.25Gbps Number of Channels: 1 Voltage - Supply: 3.14 V ~ 3.47 V Current - Supply: 40mA Current - Modulation: 100mA Current - Bias: 100mA Operating Temperature: -40°C ~ 85°C Package / Case: 32-HBCC Supplier Device Package: 32-HBCC (5x5) Mounting Type: Surface Mount	封裝: 32-HBCC	庫存7,696
MCZ33285EF	NXP	IC TMOS DRIVER DUAL HISIDE 8SOIC Driven Configuration: High-Side Channel Type: Synchronous Number of Drivers: 2 Gate Type: N-Channel MOSFET Voltage - Supply: 7 V ~ 40 V Logic Voltage - VIL, VIH: 0.7V, 1.7V Current - Peak Output (Source, Sink): - Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存14,976
MC32BC3770CSR2	NXP	IC BATT CHARGER LI-ION 25WLCSP Battery Chemistry: Lithium-Ion/Polymer Number of Cells: 1 Current - Charging: Constant - Programmable Programmable Features: Current Fault Protection: - Charge Current - Max: 2A Battery Pack Voltage: 4.475V (Max) Voltage - Supply (Max): 6.2V Interface: I2C Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 25-WFBGA, WLCSP Supplier Device Package: 25-WLCSP (2.27x2.17)	封裝: 25-WFBGA, WLCSP	庫存53,724
N74F20N,602	NXP	IC GATE NAND 2CH 4-INP 14-DIP Logic Type: NAND Gate Number of Circuits: 2 Number of Inputs: 4 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	封裝: 14-DIP (0.300", 7.62mm)	庫存5,248
N74F74N,602	NXP	IC D-TYPE POS TRG DUAL 14DIP Function: Set(Preset) and Reset Type: D-Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 125MHz Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 16mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm)	封裝: 14-DIP (0.300", 7.62mm)	庫存2,912
HEF4516BP,652	NXP	IC BINARY COUNTER UP/DOWN 16DIP Logic Type: Binary Counter Direction: Up, Down Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: Synchronous Count Rate: 18MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 15.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存6,928
74HC652N,112	NXP	IC TXRX NON-INV 3-ST 8BIT 24DIP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 24-DIP (0.600", 15.24mm) Supplier Device Package: 24-DIP	封裝: 24-DIP (0.600", 15.24mm)	庫存6,944
SC16C650AIA44,529	NXP	IC UART SINGLE W/FIFO 44-PLCC Features: - Number of Channels: 1, UART FIFO's: 32 Byte Protocol: - Data Rate (Max): 3Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存5,472
UJA1065TW/3V3,518	NXP	IC CAN/LIN FAIL-SAFE 32HTSSOP Applications: Networking Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 52 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存3,456
MPC8541EVTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存5,600
LS1024ASE7JLA	NXP	IC PROCESSOR DUAL CORE Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Voltage - I/O: - Operating Temperature: 0°C ~ 70°C (TA) Security Features: Secure Boot, TrustZone? Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	封裝: 625-BFBGA, FCBGA	庫存6,592
MK20DN512ZAB10R	NXP	IC MCU 32BIT 512KB FLASH 120CSP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 120-UFBGA, WLCSP Supplier Device Package: 120-WLCSP (5.29x5.28)	封裝: 120-UFBGA, WLCSP	庫存5,856
MC9S12GC128MPBER	NXP	IC MCU 16BIT 128KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	封裝: 52-LQFP	庫存3,424
MC9S12XHZ256VAG	NXP	IC MCU 16BIT 256KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 117 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存6,912
MCF52254AF80	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存13,860
SAF7730HV/N336,518	NXP	IC HD RADIO PROCESSOR 144HLQFP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存2,928
MPXV7007GC6T1	NXP	PRESSURE SENSOR AXIAL PORT 8-SOP Pressure Type: Compound Operating Pressure: ±1.02 PSI (±7 kPa) Output Type: Analog Voltage Output: 0.5 V ~ 4.5 V Accuracy: ±5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: ±10.88 PSI (±75 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Top Port Supplier Device Package: -	封裝: 8-SMD, Gull Wing, Top Port	庫存8,550
MC33696FJAE	NXP	IC RF TXRX ISM<1GHZ 32-VFQFN Type: TxRx Only RF Family/Standard: General ISM < 1GHz Protocol: - Modulation: FSK, OOK Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz Data Rate (Max): 22.6kbps Power - Output: 7.25dBm Sensitivity: -106.5dBm Memory Size: - Serial Interfaces: SPI GPIO: - Voltage - Supply: 2.1 V ~ 3.6 V Current - Receiving: 10.3mA ~ 24mA Current - Transmitting: 6.1mA ~ 13.5mA Operating Temperature: -20°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad	封裝: 32-VFQFN Exposed Pad	庫存18,312
BGA2714,115	NXP	IC MMIC WIDEBAND AMPLIFER 6TSSOP Frequency: 2.7GHz P1dB: -7.9dBm (0.2mW) Gain: 22dB Noise Figure: 2.2dB RF Type: - Voltage - Supply: 4V Current - Supply: 10mA Test Frequency: 950MHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	封裝: 6-TSSOP, SC-88, SOT-363	庫存5,220
MC35FS6510CAE	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP Exposed Pad	庫存3,248
SPC5748CTK1VMJ6	NXP	NXP 32-BIT MCU 6MB FLASH 160MH Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	封裝: 256-LBGA	庫存5,024
S912XEQ384BMALR	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存4,528
FS32K144MST0MLHR	NXP	S32K144 32-BIT MCU ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存3,120
MC33FS4505CAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
FX32K142UAT0VLLR	NXP	S32K142 ARM CORTEX-M4F, 112 MHZ, Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MC33FS6518NAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote

MRF6VP121KHR5

NXP

FET RF 2CH 110V 1.03GHZ NI1230H

Transistor Type: LDMOS (Dual)
Frequency: 1.03GHz
Gain: 20dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 150mA
Power - Output: 1000W
Voltage - Rated: 110V
Package / Case: NI-1230
Supplier Device Package: NI-1230

封裝: NI-1230

庫存4,784

LD6835K/18HX

NXP

IC REG LINEAR 1.8V 300MA 4HXSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.8V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.24V @ 300mA (Typ)
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 75µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Soft Start
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XDFN Exposed Pad
Supplier Device Package: 4-HXSON (1x1)

封裝: 4-XDFN Exposed Pad

庫存5,968

TZA3047BVH/C1,557

NXP

IC LASER DRIVER 1.25GBPS 32-HBCC

Type: Laser Diode Driver (Fiber Optic)
Data Rate: 1.25Gbps
Number of Channels: 1
Voltage - Supply: 3.14 V ~ 3.47 V
Current - Supply: 40mA
Current - Modulation: 100mA
Current - Bias: 100mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-HBCC
Supplier Device Package: 32-HBCC (5x5)
Mounting Type: Surface Mount

封裝: 32-HBCC

庫存7,696

MCZ33285EF

NXP

IC TMOS DRIVER DUAL HISIDE 8SOIC

Driven Configuration: High-Side
Channel Type: Synchronous
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Voltage - Supply: 7 V ~ 40 V
Logic Voltage - VIL, VIH: 0.7V, 1.7V
Current - Peak Output (Source, Sink): -
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存14,976

MC32BC3770CSR2

NXP

IC BATT CHARGER LI-ION 25WLCSP

Battery Chemistry: Lithium-Ion/Polymer
Number of Cells: 1
Current - Charging: Constant - Programmable
Programmable Features: Current
Fault Protection: -
Charge Current - Max: 2A
Battery Pack Voltage: 4.475V (Max)
Voltage - Supply (Max): 6.2V
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 25-WFBGA, WLCSP
Supplier Device Package: 25-WLCSP (2.27x2.17)

封裝: 25-WFBGA, WLCSP

庫存53,724

N74F20N,602

NXP

IC GATE NAND 2CH 4-INP 14-DIP

Logic Type: NAND Gate
Number of Circuits: 2
Number of Inputs: 4
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

封裝: 14-DIP (0.300", 7.62mm)

庫存5,248

N74F74N,602

NXP

IC D-TYPE POS TRG DUAL 14DIP

Function: Set(Preset) and Reset
Type: D-Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 125MHz
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 16mA
Input Capacitance: -
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)

封裝: 14-DIP (0.300", 7.62mm)

庫存2,912

HEF4516BP,652

NXP

IC BINARY COUNTER UP/DOWN 16DIP

Logic Type: Binary Counter
Direction: Up, Down
Number of Elements: 1
Number of Bits per Element: 4
Reset: Asynchronous
Timing: Synchronous
Count Rate: 18MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 15.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存6,928

74HC652N,112

NXP

IC TXRX NON-INV 3-ST 8BIT 24DIP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 7.8mA, 7.8mA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 24-DIP (0.600", 15.24mm)
Supplier Device Package: 24-DIP

封裝: 24-DIP (0.600", 15.24mm)

庫存6,944

SC16C650AIA44,529

NXP

IC UART SINGLE W/FIFO 44-PLCC

Features: -
Number of Channels: 1, UART
FIFO's: 32 Byte
Protocol: -
Data Rate (Max): 3Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存5,472

UJA1065TW/3V3,518

NXP

IC CAN/LIN FAIL-SAFE 32HTSSOP

Applications: Networking
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 52 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存3,456

MPC8541EVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存5,600

LS1024ASE7JLA

NXP

IC PROCESSOR DUAL CORE

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Voltage - I/O: -
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: Secure Boot, TrustZone?
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)

封裝: 625-BFBGA, FCBGA

庫存6,592

MK20DN512ZAB10R

NXP

IC MCU 32BIT 512KB FLASH 120CSP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 120-UFBGA, WLCSP
Supplier Device Package: 120-WLCSP (5.29x5.28)

封裝: 120-UFBGA, WLCSP

庫存5,856

MC9S12GC128MPBER

NXP

IC MCU 16BIT 128KB FLASH 52LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

封裝: 52-LQFP

庫存3,424

MC9S12XHZ256VAG

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, LIN, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 117
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 16x8/10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存6,912

MCF52254AF80

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存13,860

SAF7730HV/N336,518

NXP

IC HD RADIO PROCESSOR 144HLQFP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-HLQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存2,928

MPXV7007GC6T1

NXP

PRESSURE SENSOR AXIAL PORT 8-SOP

Pressure Type: Compound
Operating Pressure: ±1.02 PSI (±7 kPa)
Output Type: Analog Voltage
Output: 0.5 V ~ 4.5 V
Accuracy: ±5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: ±10.88 PSI (±75 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Top Port
Supplier Device Package: -

封裝: 8-SMD, Gull Wing, Top Port

庫存8,550

MC33696FJAE

NXP

IC RF TXRX ISM<1GHZ 32-VFQFN

Type: TxRx Only
RF Family/Standard: General ISM < 1GHz
Protocol: -
Modulation: FSK, OOK
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Data Rate (Max): 22.6kbps
Power - Output: 7.25dBm
Sensitivity: -106.5dBm
Memory Size: -
Serial Interfaces: SPI
GPIO: -
Voltage - Supply: 2.1 V ~ 3.6 V
Current - Receiving: 10.3mA ~ 24mA
Current - Transmitting: 6.1mA ~ 13.5mA
Operating Temperature: -20°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad

封裝: 32-VFQFN Exposed Pad

庫存18,312

BGA2714,115

NXP

IC MMIC WIDEBAND AMPLIFER 6TSSOP

Frequency: 2.7GHz
P1dB: -7.9dBm (0.2mW)
Gain: 22dB
Noise Figure: 2.2dB
RF Type: -
Voltage - Supply: 4V
Current - Supply: 10mA
Test Frequency: 950MHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

封裝: 6-TSSOP, SC-88, SOT-363

庫存5,220

MC35FS6510CAE

NXP

FS6500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP Exposed Pad

庫存3,248

SPC5748CTK1VMJ6

NXP

NXP 32-BIT MCU 6MB FLASH 160MH

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封裝: 256-LBGA

庫存5,024

S912XEQ384BMALR

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存4,528

FS32K144MST0MLHR

NXP

S32K144 32-BIT MCU ARM CORTEX-M

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存3,120

MC33FS4505CAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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FX32K142UAT0VLLR

NXP

S32K142 ARM CORTEX-M4F, 112 MHZ,

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MC33FS6518NAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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