Plessey - New range of GaN-on-silicon LED die for medium to high-power applications | 黑森爾電子
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Plessey - New range of GaN-on-silicon LED die for medium to high-power applications

Technology Cover
發佈日期: 2015-09-24
Plessey has released its new series of MaGIC LED chips, which are manufactured using the company's patented GaN-on-Silicon technology. Blue die is sometimes called blue pump because it can pump the phosphor to the white range. It is the latest innovation in high-brightness LED die. It is designed for a variety of medium and high power applications, including general lighting, signage , Commercials, residential and street lighting. Dr. Keith Strickland, Chief Technology Officer of Plessey, commented: "We have developed a variety of LED dies for a variety of applications, and our silicon-based GaN technology is used in high-power applications such as high-bay lights, street lights, projection lights, radios Lamps and floodlights. The current process technology will be the basis of our dedicated LED, ASLED, which bridges the gap between LED component suppliers, designers of solid state lighting fixtures and OEMs. " This manufacturing process produces vertical LEDs Structure with the anode as the bottom contact and the cathode formed in the top metal layer. The layout of the top metal layer is optimized for a specific LED size and chip operating current and includes one or more solders for connection to the cathode disk Giuliano Cassataro vice president of worldwide sales Plessey added: "we see a clear pace discrete PLCC designed by its own growth and semiconductor processing facility in Plymouth, Plessey can provide many high-end applications, especially in high-power applications. The required flexibility and responsiveness, these high-end applications can take advantage of the heat of our silicon LED die Light output. " Plessey variety provides the blue range of the wavelength selection. The chip is capable of producing more than 60% of light output efficiency, sometimes referred to as a wall plug efficiency (WPE), which provides a standard thickness of 150 m, while the thickness may provide other The minimum thickness (minimum 75 μm). The mold is provided in a single strength and blue tape with a ribbon cartridge to provide tight uniformity and is intended to be used with standard pick and place machines. The company states that the sample has multiple bare Chip package format, blue die wavelength range from 420nm to 480nm, from mW to 10W, while the typical optical output power of PExS4500 series at 3A drive current is 4000mW.