頁 37 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC) | 黑森爾電子
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嵌入式 - 微控制器、微處理器、FPGA 模組

記錄 1,650
頁  37/59
圖片
零件編號
製造商
描述
封裝
庫存
數量
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
M5485HFEE-E
Logic

MODULE FIRE ENGINE

  • Module/Board Type: MPU Core
  • Core Processor: ColdFire V4e, MCF5485
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 16MB (NOR), 2MB (Boot)
  • RAM Size: 64MB
  • Connector Type: -
  • Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存6,736
ColdFire V4e, MCF5485
-
200MHz
16MB (NOR), 2MB (Boot)
64MB
-
3.7" x 4.5" (95mm x 114mm)
-40°C ~ 85°C
CC-9C-V212-Z1-B
Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 4MB
  • RAM Size: 16MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存3,168
ARM926EJ-S, NS9360
-
155MHz
4MB
16MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
DC-ME-Y413-S-B
Digi International

ME 9210 16MB SDRAM 8MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 16MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 80°C
封裝: -
庫存5,216
ARM926EJ-S, NS9210
-
75MHz
16MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 80°C
101-0961
Digi International

MODULE RABBITCORE RCM3720

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 512KB (Internal), 1MB (External)
  • RAM Size: 256KB
  • Connector Type: IDC Header 2x20
  • Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
  • Operating Temperature: -40°C ~ 70°C
封裝: -
庫存5,408
Rabbit 3000
-
22.1MHz
512KB (Internal), 1MB (External)
256KB
IDC Header 2x20
1.2" x 2.95" (30mm x 75mm)
-40°C ~ 70°C
CENGSH7760-10-504HCR
Logic

CARD ENGINE 32MB FLASH 64MB RAM

  • Module/Board Type: MPU Core
  • Core Processor: SH7760
  • Co-Processor: -
  • Speed: 198MHz
  • Flash Size: 32MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存5,328
SH7760
-
198MHz
32MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
CENGLH7A404-11-403EC
Logic

CARD ENGINE 16MB FLASH 32MB RAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM922T, LH7A404
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 16MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存2,496
ARM922T, LH7A404
-
200MHz
16MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
DC-SP-01-C-W-25
Digi International

ADAPTER SP CUSTOMIZABLE 25PK

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 16MB
  • Connector Type: RJ45
  • Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存2,688
ARM7TDMI, NS7520
-
55MHz
4MB
16MB
RJ45
3.88" x 1.68" (98.5mm x 42.7mm)
-40°C ~ 85°C
CC-MX-PF58-ZM-B
Digi International

MOD WI-IMX287 256M FLASH 25/PK

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S i.mx287
  • Co-Processor: -
  • Speed: 454MHz
  • Flash Size: 256MB
  • RAM Size: 256MB
  • Connector Type: Edge Connector - 52
  • Size / Dimension: 2" x 1.38" (51mm x 35mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存3,008
ARM926EJ-S i.mx287
-
454MHz
256MB
256MB
Edge Connector - 52
2" x 1.38" (51mm x 35mm)
-40°C ~ 85°C
6711-KA-1X1-RI
Critical Link LLC

MITYDSP SOM TMS320C6711 167MHZ

  • Module/Board Type: DSP, FPGA Core
  • Core Processor: TMS320C6711
  • Co-Processor: Spartan-3, XC3S400
  • Speed: 167MHz
  • Flash Size: 2MB
  • RAM Size: 64KB (Internal), 8MB (External)
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存5,840
TMS320C6711
Spartan-3, XC3S400
167MHz
2MB
64KB (Internal), 8MB (External)
SO-DIMM-144
2.66" x 1.5" (67.6mm x 38.1mm)
-40°C ~ 85°C
CC-MX-MB6B-ZK
Digi International

MODULE I.MX51 600MHZ 3GB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
庫存7,632
-
-
-
-
-
-
-
-
TE0728-04-1Q
Trenz Electronic GmbH

XILINX ZYNQ XA7Z020-1CLG484Q AUT

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: Samtec SEM
  • Size / Dimension: 2.36" x 2.36" (60mm x 60mm)
  • Operating Temperature: -
封裝: -
庫存6,640
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
16MB
512MB
Samtec SEM
2.36" x 2.36" (60mm x 60mm)
-
CC-9P-V502-C-B
Digi International

MOD 9P 8MB SDRAM 4MB FLASH 25PAK

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9215
  • Co-Processor: -
  • Speed: 150MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存7,856
ARM926EJ-S, NS9215
-
150MHz
4MB
8MB
Board-to-Board (BTB) Socket - 160
1.97" x 1.97" (50mm x 50mm)
-40°C ~ 85°C
20-101-1154
Digi International

MODULE RCM4120 RABBITCORE

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 4000
  • Co-Processor: -
  • Speed: 58.98MHz
  • Flash Size: 512KB
  • RAM Size: 1MB
  • Connector Type: IDC Header 2x25, 2x5
  • Size / Dimension: 1.41" x 1.88" (36mm x 48mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存7,568
Rabbit 4000
-
58.98MHz
512KB
1MB
IDC Header 2x25, 2x5
1.41" x 1.88" (36mm x 48mm)
-40°C ~ 85°C
DLP-HS-FPGA-A
DLP Design Inc.

MODULE USB-TO-FPGA SPARTAN3

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-3A, XC3S200A
  • Co-Processor: FT2232H
  • Speed: 66MHz
  • Flash Size: -
  • RAM Size: 32MB
  • Connector Type: USB - B, Pin Header
  • Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存6,816
Spartan-3A, XC3S200A
FT2232H
66MHz
-
32MB
USB - B, Pin Header
3" x 1.2" (76.2mm x 30.5mm)
0°C ~ 70°C
SOMDM3730-11-1783JFIR
Logic

DM3730 SOM-LV TYPE III 800MHZ 25

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
庫存4,800
-
-
-
-
-
-
-
-
OSD3358-512M-IND
Octavo Systems LLC

SIP SOM AM3358 512MB DDR3

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A8, AM3358
  • Co-Processor: NEON™ SIMD
  • Speed: 1GHz
  • Flash Size: -
  • RAM Size: 512MB
  • Connector Type: 400-BGA
  • Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存7,080
ARM® Cortex®-A8, AM3358
NEON™ SIMD
1GHz
-
512MB
400-BGA
1.06" x 1.06" (27.0mm x 27.0mm)
-40°C ~ 85°C
OSD32MP157C-512M-IAA
Octavo Systems LLC

SIP ARM CORTEX STM32MP157C

  • Module/Board Type: MPU Core
  • Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
  • Co-Processor: NEON™ SIMD
  • Speed: 650MHz, 209MHz
  • Flash Size: -
  • RAM Size: -
  • Connector Type: 302-BGA
  • Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存1,929
Arm® Dual Cortex®-A7, Arm® Cortex®-M4
NEON™ SIMD
650MHz, 209MHz
-
-
302-BGA
0.709" L x 0.709" W (18.00mm x 18.00mm)
-40°C ~ 85°C
MYC-CZU3EG-V2-4E4D-1200-C
MYIR Tech Limited

System-On-Module, ZU3EG

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
  • Speed: 2.4GHz
  • Flash Size: 4GB eMMC, 128MB QSPI
  • RAM Size: 4GB
  • Connector Type: Pin(s)
  • Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
2.4GHz
4GB eMMC, 128MB QSPI
4GB
Pin(s)
2.362" L x 2.047" W (60.00mm x 52.00mm)
0°C ~ 70°C
TE0726-04-41C94-A
Trenz Electronic GmbH

IC MODULE ZYNQBERRY

  • Module/Board Type: FPGA
  • Core Processor: Zynq™ XC7Z010-1CLG225C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: RJ45
  • Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
Zynq™ XC7Z010-1CLG225C
-
-
16MB
512MB
RJ45
3.661" L x 2.500" W (93.00mm x 63.50mm)
0°C ~ 70°C
20-101-0030
Digi

BL1600 CONTROLLER

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
-
-
-
-
-
-
-
-
MA-ZX3-20-2I-D10-R7
Enclustra FPGA Solutions

SOM ZYNQ 7Z020 1GB

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: 50MHz
  • Flash Size: 1GB (NAND)
  • RAM Size: 1.024GB
  • Connector Type: 200 Pin
  • Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7020)
50MHz
1GB (NAND)
1.024GB
200 Pin
2.660" L x 1.180" W (67.60mm x 30.00mm)
-40°C ~ 85°C
TE0600-03IC4
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
Spartan-6 LX-45
-
125MHz
16MB
256MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
ME-XU1-9EG-3E-D12E-R5-0
Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E
600MHz, 1.5GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
0°C ~ 85°C
TE0630-02IBFC1
Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
-
-
-
-
-
-
-
-
MA-ZX2-20-2I-D9-R2
Enclustra FPGA Solutions

SOM ZYNQ 7Z020 512MB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 512MB
  • Connector Type: 200 Pin
  • Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存96
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
64MB
512MB
200 Pin
2.660" L x 1.180" W (67.60mm x 30.00mm)
-40°C ~ 85°C
TE0818-01-9GI21-AK
Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
Zynq UltraScale+ XCZU9EG-2FFVC900I
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
-40°C ~ 85°C
TE0741-05-B2I-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0745-02-92I31-AK
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7045)
-
64MB
1GB
Board-to-Board (BTB) Socket - 480
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C