頁 40 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-9P-T237-Z1	Digi International	MODULE 9P 64MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,024	-	-	-	-	-	-	-	-
FS-333	Digi International	MODULE MOD NET50 2MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,704	-	-	-	-	-	-	-	-
CENGLH7A404-11-504HC-B	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,768	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
TE0782-02-035-2I	Trenz Electronic GmbH	SOM ZYNQ XC7Z035-2I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec QTH Size / Dimension: 3.35" x 3.35" (85mm x 85mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,000	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec QTH	3.35" x 3.35" (85mm x 85mm)	-40°C ~ 85°C
TE0725LP-01-100-2L	Trenz Electronic GmbH	SOM ARTIX-7 XC7A100T-2C FLASH Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 25MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: -	封裝: -	庫存4,064	Artix-7 A100T	-	25MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	-
TE0725LP-01-100-2D	Trenz Electronic GmbH	SOM ARTIX-7 XC7A100T-2C FLASH Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 25MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: -	封裝: -	庫存2,832	Artix-7 A100T	-	25MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	-
DC-ME-01T-PC	Digi International	ME 8MB SDRAM 2MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,352	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0725-03-15-1C	Trenz Electronic GmbH	SOM ARTIX-7 15T FLASH 1C Module/Board Type: FPGA Core Processor: Artix-7 A15T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,392	Artix-7 A15T	-	100MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
ADSP-3PARCBF548M01	Analog Devices Inc.	MODULE BOARD BF548 Module/Board Type: MPU Core Core Processor: BF548 Co-Processor: - Speed: 533MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-200 Size / Dimension: 2.24" x 2.64" (56.9mm x 67mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,368	BF548	-	533MHz	32MB	64MB	SO-DIMM-200	2.24" x 2.64" (56.9mm x 67mm)	-40°C ~ 85°C
TE0722-02-07S-1C	Trenz Electronic GmbH	SOM ZYNQ SOFT PROPELLER Z-7007S Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7000S) Speed: 33MHz Flash Size: 16MB RAM Size: - Connector Type: 40 Pin Size / Dimension: 0.71" x 2.01" (18mm x 51mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,064	ARM Cortex-A9	Zynq-7000 (Z-7000S)	33MHz	16MB	-	40 Pin	0.71" x 2.01" (18mm x 51mm)	0°C ~ 70°C
L138-FI-236-RL	Critical Link LLC	MITYDSP-L138F SOM OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) Speed: 456MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存7,040	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	456MHz	512MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	-40°C ~ 70°C
TE0720-03-2IF	Trenz Electronic GmbH	SOM ZYNQ XC7Z020-2I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,648	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
BS2PX24	Parallax Inc.	MODULE BASIC STAMP 2PX24 Module/Board Type: MCU Core Core Processor: SX48AC Co-Processor: - Speed: 32MHz Flash Size: 16KB EEPROM RAM Size: 38B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,120	SX48AC	-	32MHz	16KB EEPROM	38B	-	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
TE0820-03-04CG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存6,688	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0820-03-03CG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存6,432	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	0°C ~ 85°C
TE0890-01-25-1C	Trenz Electronic GmbH	IC MOD SPARTAN-7 100MHZ 64MBIT Module/Board Type: FPGA Core Core Processor: Xilinx Spartan-7 XC7S25 Co-Processor: - Speed: 100MHz Flash Size: 64Mbit RAM Size: 64Mbit Connector Type: Dual-pinout DIP-40 or 50mil 80 pin connector Size / Dimension: 1.06" x 2.05" (27.0mm x 52.0mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,960	Xilinx Spartan-7 XC7S25	-	100MHz	64Mbit	64Mbit	Dual-pinout DIP-40 or 50mil 80 pin connector	1.06" x 2.05" (27.0mm x 52.0mm)	0°C ~ 70°C
TE0712-02-200-1I3	Trenz Electronic GmbH	IC MOD ARTIX7 A200T 200MHZ 1GB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0712-03-82C36-L	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0808-05-9BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: - Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -	封裝: -	Request a Quote	-	-	-	128MB	4GB	-	2.990" L x 2.050" W (76.00mm x 52.00mm)	-
TE0820-04-50121FA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0745-02-72I11-A	Trenz Electronic GmbH	SOM 1GB DDR3 XC7Z030-2FBG676I Module/Board Type: MPU Core Core Processor: Xilinx Zynq XC7Z030-2FBG676I Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Zynq XC7Z030-2FBG676I	-	-	64MB	1GB	Samtec ST5	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0813-01-2BE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
FORLINX-FETMX9352-C-151GSE8GIB11	Forlinx Embedded	NXP i.MX9352SOM,1GB LPDDR4, 8GB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
OSD32MP157C-512M-BAA-ES	Octavo Systems LLC	SIP ARM CORTEX STM32MP157C Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz, 209MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	0°C ~ 85°C
DC-VA-H264-10B-60-1080-MXC-SL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0720-03-62I33MAN	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	8GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0808-04-9GI21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0745-03-71I31-AZ	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: FPGA Core Processor: AMD/Xilinx Zynq™ 7030 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	AMD/Xilinx Zynq™ 7030	-	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

CC-9P-T237-Z1

Digi International

MODULE 9P 64MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,024

-

FS-333

Digi International

MODULE MOD NET50 2MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,704

-

CENGLH7A404-11-504HC-B

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,768

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

TE0782-02-035-2I

Trenz Electronic GmbH

SOM ZYNQ XC7Z035-2I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec QTH
Size / Dimension: 3.35" x 3.35" (85mm x 85mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,000

ARM Cortex-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Samtec QTH

3.35" x 3.35" (85mm x 85mm)

-40°C ~ 85°C

TE0725LP-01-100-2L

Trenz Electronic GmbH

SOM ARTIX-7 XC7A100T-2C FLASH

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 25MHz
Flash Size: 32MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: -

封裝: -

庫存4,064

Artix-7 A100T

-

25MHz

32MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

-

TE0725LP-01-100-2D

Trenz Electronic GmbH

SOM ARTIX-7 XC7A100T-2C FLASH

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 25MHz
Flash Size: 32MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: -

封裝: -

庫存2,832

Artix-7 A100T

-

25MHz

32MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

-

DC-ME-01T-PC

Digi International

ME 8MB SDRAM 2MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,352

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0725-03-15-1C

Trenz Electronic GmbH

SOM ARTIX-7 15T FLASH 1C

Module/Board Type: FPGA
Core Processor: Artix-7 A15T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,392

Artix-7 A15T

-

100MHz

32MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

0°C ~ 70°C

ADSP-3PARCBF548M01

Analog Devices Inc.

MODULE BOARD BF548

Module/Board Type: MPU Core
Core Processor: BF548
Co-Processor: -
Speed: 533MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-200
Size / Dimension: 2.24" x 2.64" (56.9mm x 67mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,368

BF548

-

533MHz

32MB

64MB

SO-DIMM-200

2.24" x 2.64" (56.9mm x 67mm)

-40°C ~ 85°C

TE0722-02-07S-1C

Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER Z-7007S

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7000S)
Speed: 33MHz
Flash Size: 16MB
RAM Size: -
Connector Type: 40 Pin
Size / Dimension: 0.71" x 2.01" (18mm x 51mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,064

ARM Cortex-A9

Zynq-7000 (Z-7000S)

33MHz

16MB

-

40 Pin

0.71" x 2.01" (18mm x 51mm)

0°C ~ 70°C

L138-FI-236-RL

Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed: 456MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存7,040

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)

456MHz

512MB (NAND), 8MB (NOR)

8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

-40°C ~ 70°C

TE0720-03-2IF

Trenz Electronic GmbH

SOM ZYNQ XC7Z020-2I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,648

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

BS2PX24

Parallax Inc.

MODULE BASIC STAMP 2PX24

Module/Board Type: MCU Core
Core Processor: SX48AC
Co-Processor: -
Speed: 32MHz
Flash Size: 16KB EEPROM
RAM Size: 38B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,120

SX48AC

-

32MHz

16KB EEPROM

38B

-

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

TE0820-03-04CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存6,688

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

TE0820-03-03CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存6,432

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

0°C ~ 85°C

TE0890-01-25-1C

Trenz Electronic GmbH

IC MOD SPARTAN-7 100MHZ 64MBIT

Module/Board Type: FPGA Core
Core Processor: Xilinx Spartan-7 XC7S25
Co-Processor: -
Speed: 100MHz
Flash Size: 64Mbit
RAM Size: 64Mbit
Connector Type: Dual-pinout DIP-40 or 50mil 80 pin connector
Size / Dimension: 1.06" x 2.05" (27.0mm x 52.0mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,960

Xilinx Spartan-7 XC7S25

-

100MHz

64Mbit

Dual-pinout DIP-40 or 50mil 80 pin connector

1.06" x 2.05" (27.0mm x 52.0mm)

0°C ~ 70°C

TE0712-02-200-1I3

Trenz Electronic GmbH

IC MOD ARTIX7 A200T 200MHZ 1GB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0712-03-82C36-L

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0808-05-9BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: -
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -

封裝: -

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-

128MB

4GB

-

2.990" L x 2.050" W (76.00mm x 52.00mm)

-

TE0820-04-50121FA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

TE0745-02-72I11-A

Trenz Electronic GmbH

SOM 1GB DDR3 XC7Z030-2FBG676I

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq XC7Z030-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Zynq XC7Z030-2FBG676I

-

64MB

1GB

Samtec ST5

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0813-01-2BE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

FORLINX-FETMX9352-C-151GSE8GIB11

Forlinx Embedded

NXP i.MX9352SOM,1GB LPDDR4, 8GB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

OSD32MP157C-512M-BAA-ES

Octavo Systems LLC

SIP ARM CORTEX STM32MP157C

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz, 209MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz, 209MHz

-

512MB

302-BGA

0.709" L x 0.709" W (18.00mm x 18.00mm)

0°C ~ 85°C

DC-VA-H264-10B-60-1080-MXC-SL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0720-03-62I33MAN

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

8GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0808-04-9GI21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU9EG-2FFVC900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0745-03-71I31-AZ

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: FPGA
Core Processor: AMD/Xilinx Zynq™ 7030
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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AMD/Xilinx Zynq™ 7030

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C