頁 52 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-PE47-MQ-1	Digi International	MODULE CONNECTCORE I.MX280 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,856	-	-	-	-	-	-	-	-
DC-ME-Y402-MF-B	Digi International	MOD ME 8MB SDRAM 4MB FLASH 25P Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封裝: -	庫存2,928	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
CC-9P-V502-ZA-C-B	Digi International	MODULE 9P 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,216	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
20-101-0087	Digi International	CORE MODULE CM7200 Module/Board Type: MPU Core Core Processor: Z180 Co-Processor: - Speed: 18.432MHz Flash Size: 128KB RAM Size: 128KB Connector Type: 40 Pin Header Size / Dimension: 1.8" x 2.05" (46mm x 52mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存6,864	Z180	-	18.432MHz	128KB	128KB	40 Pin Header	1.8" x 2.05" (46mm x 52mm)	-40°C ~ 70°C
DC-ME-Y413-S	Digi International	ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 16MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封裝: -	庫存5,184	ARM926EJ-S, NS9210	-	75MHz	16MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
MK67Q5250V-0001YC	Rohm Semiconductor	IC BIOMETRIX MODULE SNAP IN Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,760	-	-	-	-	-	-	-	-
SOMOMAP3530-10-1672IFXR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -20°C ~ 85°C	封裝: -	庫存2,128	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	-20°C ~ 85°C
FS-3003	Digi International	MODULE 128MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,712	-	-	-	-	-	-	-	-
FS-3005	Digi International	MODULE 128MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,544	-	-	-	-	-	-	-	-
EZ80L925048MODG	Zilog	IC WEBSERVER 48MHZ 1MB MOD Module/Board Type: MCU Core Core Processor: eZ80L92 Co-Processor: - Speed: 48MHz Flash Size: 1MB RAM Size: 512KB Connector Type: Header 2x25 Size / Dimension: 2.5" x 2.5" (64mm x 64mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,224	eZ80L92	-	48MHz	1MB	512KB	Header 2x25	2.5" x 2.5" (64mm x 64mm)	0°C ~ 70°C
TE0714-02-35-2I	Trenz Electronic GmbH	SOM ARTIX7 XC7A35T-2CSG325I 2I Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: - Flash Size: 16MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.57" x 1.18" (40mm x 30mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,160	Artix-7 A35T	-	-	16MB	-	Samtec LSHM	1.57" x 1.18" (40mm x 30mm)	-40°C ~ 85°C
20-101-0435	Digi International	MODULE RABBITCORE RCM2110 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存7,152	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 70°C
3352-HX-X27-RC	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 256MB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,328	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	256MB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
TE0714-02-50-2I	Trenz Electronic GmbH	SOM ARTIX-7 XC7A50T-2I 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A50T Co-Processor: - Speed: - Flash Size: 16MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.57" x 1.18" (40mm x 30mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,680	Artix-7 A50T	-	-	16MB	-	Samtec LSHM	1.57" x 1.18" (40mm x 30mm)	-40°C ~ 85°C
100-1225-1	Bluetechnix GmbH	CORE MOD TCM-BF537 500MHZ CONN Module/Board Type: MPU Core Core Processor: TCM-BF537 Co-Processor: - Speed: 500MHz Flash Size: 8MB RAM Size: 32MB Connector Type: Expansion 2 x 60 Size / Dimension: 1.1" x 1.1" (28mm x 28mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,352	TCM-BF537	-	500MHz	8MB	32MB	Expansion 2 x 60	1.1" x 1.1" (28mm x 28mm)	-40°C ~ 85°C
20-101-1139	Digi International	RCM4310 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 1MB (Internal), microSD Slot (External) RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card Size / Dimension: 1.84" x 2.85" (47mm x 72mm) Operating Temperature: -20°C ~ 85°C	封裝: -	庫存4,912	Rabbit 4000	-	58.98MHz	1MB (Internal), microSD Slot (External)	1MB	IDC Header 2x25, 2x5, 1xmicroSD Card	1.84" x 2.85" (47mm x 72mm)	-20°C ~ 85°C
CC-MX-PF58-ZK	Digi International	MOD I.MX287 256MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,608	ARM926EJ-S i.mx287	-	454MHz	256MB	256MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
DC-ME-01T-KC	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,008	-	-	-	-	-	-	-	-
TE0745-02-45-1CA	Trenz Electronic GmbH	SOM ZYNQ 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,320	ARM® Cortex®-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
TE0808-04-15EG-1EE	Trenz Electronic GmbH	SOM USCALE+ XCZU15EG-1F 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存3,904	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0803-02-02CG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存4,592	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0808-05-9BE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-03-4BE21-L	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
DC-V-H264-8B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
L138-DG-325-RI-1	Critical Link LLC	MOD MITYDSP-L138F OMAP-L138, FPG Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) Speed: 375MHz Flash Size: 256MB (NAND), 16MB (NOR) RAM Size: 8kB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)	375MHz	256MB (NAND), 16MB (NOR)	8kB (Internal), 128MB (External)	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	-40°C ~ 85°C
TE0720-03-62I330M	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-15EG-2I-D12E-G1-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
XP1002000-05R-J	Lantronix, Inc.	XPORT 05, W/AES, JAPAN ONLY Module/Board Type: - Core Processor: DSTni-EX Co-Processor: XPort AR Speed: 25MHz Flash Size: 512KB RAM Size: 256KB Connector Type: RJ-45 Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
5749-PJ-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5749 SOM WIT Module/Board Type: MPU, FPGA Core Core Processor: ARM Cortex-A15 Co-Processor: Artix-7 Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A15	Artix-7	1.5GHz	32MB	1GB	Edge Connector - 310, Board-to-Board (BTB) - 100	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
TE0807-03-7DI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU7EV-1FBVB900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C

CC-MX-PE47-MQ-1

Digi International

MODULE CONNECTCORE I.MX280

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,856

-

DC-ME-Y402-MF-B

Digi International

MOD ME 8MB SDRAM 4MB FLASH 25P

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封裝: -

庫存2,928

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

CC-9P-V502-ZA-C-B

Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,216

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

20-101-0087

Digi International

CORE MODULE CM7200

Module/Board Type: MPU Core
Core Processor: Z180
Co-Processor: -
Speed: 18.432MHz
Flash Size: 128KB
RAM Size: 128KB
Connector Type: 40 Pin Header
Size / Dimension: 1.8" x 2.05" (46mm x 52mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存6,864

Z180

-

18.432MHz

128KB

40 Pin Header

1.8" x 2.05" (46mm x 52mm)

-40°C ~ 70°C

DC-ME-Y413-S

Digi International

ME 9210 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 16MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封裝: -

庫存5,184

ARM926EJ-S, NS9210

-

75MHz

16MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

MK67Q5250V-0001YC

Rohm Semiconductor

IC BIOMETRIX MODULE SNAP IN

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,760

-

SOMOMAP3530-10-1672IFXR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: -20°C ~ 85°C

封裝: -

庫存2,128

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB (NAND), 8MB (NOR)

128MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

-20°C ~ 85°C

FS-3003

Digi International

MODULE 128MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,712

-

FS-3005

Digi International

MODULE 128MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,544

-

EZ80L925048MODG

Zilog

IC WEBSERVER 48MHZ 1MB MOD

Module/Board Type: MCU Core
Core Processor: eZ80L92
Co-Processor: -
Speed: 48MHz
Flash Size: 1MB
RAM Size: 512KB
Connector Type: Header 2x25
Size / Dimension: 2.5" x 2.5" (64mm x 64mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,224

eZ80L92

-

48MHz

1MB

512KB

Header 2x25

2.5" x 2.5" (64mm x 64mm)

0°C ~ 70°C

TE0714-02-35-2I

Trenz Electronic GmbH

SOM ARTIX7 XC7A35T-2CSG325I 2I

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,160

Artix-7 A35T

-

16MB

-

Samtec LSHM

1.57" x 1.18" (40mm x 30mm)

-40°C ~ 85°C

20-101-0435

Digi International

MODULE RABBITCORE RCM2110

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存7,152

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 70°C

3352-HX-X27-RC

Critical Link LLC

MITYSOM-3352 W/ AM3352

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,328

ARM? Cortex?-A8, AM3352

NEON SIMD

800MHz

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

TE0714-02-50-2I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A50T-2I 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A50T
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,680

Artix-7 A50T

-

16MB

-

Samtec LSHM

1.57" x 1.18" (40mm x 30mm)

-40°C ~ 85°C

100-1225-1

Bluetechnix GmbH

CORE MOD TCM-BF537 500MHZ CONN

Module/Board Type: MPU Core
Core Processor: TCM-BF537
Co-Processor: -
Speed: 500MHz
Flash Size: 8MB
RAM Size: 32MB
Connector Type: Expansion 2 x 60
Size / Dimension: 1.1" x 1.1" (28mm x 28mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,352

TCM-BF537

-

500MHz

8MB

32MB

Expansion 2 x 60

1.1" x 1.1" (28mm x 28mm)

-40°C ~ 85°C

20-101-1139

Digi International

RCM4310 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 1MB (Internal), microSD Slot (External)
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card
Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
Operating Temperature: -20°C ~ 85°C

封裝: -

庫存4,912

Rabbit 4000

-

58.98MHz

1MB (Internal), microSD Slot (External)

1MB

IDC Header 2x25, 2x5, 1xmicroSD Card

1.84" x 2.85" (47mm x 72mm)

-20°C ~ 85°C

CC-MX-PF58-ZK

Digi International

MOD I.MX287 256MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,608

ARM926EJ-S i.mx287

-

454MHz

256MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

DC-ME-01T-KC

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,008

-

TE0745-02-45-1CA

Trenz Electronic GmbH

SOM ZYNQ 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,320

ARM® Cortex®-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

TE0808-04-15EG-1EE

Trenz Electronic GmbH

SOM USCALE+ XCZU15EG-1F 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存3,904

Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0803-02-02CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存4,592

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0808-05-9BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0803-03-4BE21-L

Trenz Electronic GmbH

MODULE SOM TE0803-03

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

DC-V-H264-8B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

L138-DG-325-RI-1

Critical Link LLC

MOD MITYDSP-L138F OMAP-L138, FPG

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
Speed: 375MHz
Flash Size: 256MB (NAND), 16MB (NOR)
RAM Size: 8kB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)

375MHz

256MB (NAND), 16MB (NOR)

8kB (Internal), 128MB (External)

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

-40°C ~ 85°C

TE0720-03-62I330M

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-15EG-2I-D12E-G1-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

XP1002000-05R-J

Lantronix, Inc.

XPORT 05, W/AES, JAPAN ONLY

Module/Board Type: -
Core Processor: DSTni-EX
Co-Processor: XPort AR
Speed: 25MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: RJ-45
Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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DSTni-EX

XPort AR

25MHz

512KB

256KB

RJ-45

1.330" L x 0.640" W (33.90mm x 16.25mm)

-40°C ~ 85°C

5749-PJ-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5749 SOM WIT

Module/Board Type: MPU, FPGA Core
Core Processor: ARM Cortex-A15
Co-Processor: Artix-7
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A15

Artix-7

1.5GHz

32MB

1GB

Edge Connector - 310, Board-to-Board (BTB) - 100

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

TE0807-03-7DI21-A

Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

Request a Quote

Zynq UltraScale+ XCZU7EV-1FBVB900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C