頁 54 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-MB58-ZM	Digi International	MODULE I.MX51 600MHZ 256MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,712	-	-	-	-	-	-	-	-
CC-9P-V527UJ-S-B	Digi International	MODULE 3G 9P 32SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,200	-	-	-	-	-	-	-	-
CC-MX-LB47-ZM	Digi International	MODULE I.MX51 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,280	-	-	-	-	-	-	-	-
CC-9M-NA59-Z1	Digi International	MOD 9M 256MB SDRAM 512MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,536	ARM920T, SC2443	-	533MHz	512MB	256MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
M5475EFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,040	ColdFire V4e, MCF5475	-	266MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	0°C ~ 70°C
MOD5270BXCE	NXP	MOD NETBURNER MOD5270 100 UNITS Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Co-Processor: - Speed: 95MHz Flash Size: 512KB RAM Size: 2.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,936	ColdFire 5270	-	95MHz	512KB	2.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
FS-372	Digi International	MODULE 32MB SDRAM 32MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2440 Co-Processor: - Speed: 400MHz Flash Size: 32MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -25°C ~ 75°C	封裝: -	庫存2,960	ARM920T, SC2440	-	400MHz	32MB	32MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-25°C ~ 75°C
FS-327	Digi International	MODULE DIMM52016MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,112	-	-	-	-	-	-	-	-
FS-662	Digi International	MODULE A9M2440 32MB SDRAM FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,448	-	-	-	-	-	-	-	-
FS-383	Digi International	MODULE 9P 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,024	-	-	-	-	-	-	-	-
CENGLH7A400-10-402EC	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,680	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
TE0320-00-EV02	Trenz Electronic GmbH	SOM SPARTAN-3A 1800K 1333MB DDR Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A DSP Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 4MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 2.7" x 1.9" (68mm x 48mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,904	Spartan-3A DSP	Cypress EZ-USB FX2LP	100MHz	4MB	128MB	B2B	2.7" x 1.9" (68mm x 48mm)	0°C ~ 70°C
TE0741-03-160-2IF	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,568	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-9P-T225-Z1	Digi International	MODULE 9P 32MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,008	-	-	-	-	-	-	-	-
SOMDM3730-32-2880AKXR	Logic	SOM TORPEDO WIRELESS 1GHZ EXT Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 1GHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存7,608	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	1GHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	-40°C ~ 70°C
EZ80F917150MODG	Zilog	BOARD ZDOTS SBC Z80ACCLAIM PLUS Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB (Internal), 8MB (External) RAM Size: 8KB (Internal), 512KB (External) Connector Type: Header 2x30 Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,212	eZ80F91	-	50MHz	256KB (Internal), 8MB (External)	8KB (Internal), 512KB (External)	Header 2x30	2.5" x 3.1" (63.5mm x 78.7mm)	0°C ~ 70°C
DC-ME-01T-EBE-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,480	-	-	-	-	-	-	-	-
A10S-P9-X5E-RI-SA	Critical Link LLC	IC MODULE CORTEX-A9 1.2GHZ 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 6GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4" x 4" (101.5mm x 101.5mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,296	ARM® Cortex®-A9, Arria 10 SX	NEON™ SIMD	1.2GHz	-	6GB	Board-to-Board (BTB)	4" x 4" (101.5mm x 101.5mm)	-40°C ~ 85°C
TE0803-03-3BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存7,840	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
ME-SA1-C6-7I-D10-R3	Enclustra FPGA Solutions	SOM CYCLONE V 5CSXFC6 1GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: - Speed: 800MHz Flash Size: 16GB RAM Size: 1GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存33	ARM® Dual-Core Cortex-A9	-	800MHz	16GB	1GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
MCV-6DB	ARIES Embedded	SoM CycloneV SoC-FPGA Module/Board Type: FPGA Core Processor: ARM Cortex-A9 (Dual Core) Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 1GB Connector Type: 360 Pin Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9 (Dual Core)	-	800MHz	4GB	1GB	360 Pin	2.910" L x 1.650" W (74.00mm x 42.00mm)	0°C ~ 70°C
TE0715-04-30-1IA	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0714-04-52I-7-B	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A50T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3	Artix-7 A50T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
TE0782-02-92I33FH	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Board-to-Board (BTB) Socket - 480	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
ME-XU1-15EG-2I-D12E-G1-R4-1	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0741-05-G2I-1-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K410T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
DC-V-H264-10B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0820-05-3BE81ML	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
MA5D4-20A0A051E	ARIES Embedded	SoM SAMA5D42 Module/Board Type: - Core Processor: SAMA5D42 Co-Processor: - Speed: 528MHz Flash Size: 4GB (NAND) RAM Size: 128MB Connector Type: - Size / Dimension: - Operating Temperature: -25°C ~ 85°C	封裝: -	Request a Quote	SAMA5D42	-	528MHz	4GB (NAND)	128MB	-	-	-25°C ~ 85°C
TE0835-02-TXE21-A	Trenz Electronic GmbH	RFSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E Co-Processor: ARM® Cortex®-A53 Speed: 1.3GHz Flash Size: 512MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E	ARM® Cortex®-A53	1.3GHz	512MB	4GB	Board-to-Board (BTB) Socket	3.543" L x 2.559" W (90.00mm x 65.00mm)	0°C ~ 85°C

CC-MX-MB58-ZM

Digi International

MODULE I.MX51 600MHZ 256MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,712

-

CC-9P-V527UJ-S-B

Digi International

MODULE 3G 9P 32SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,200

-

CC-MX-LB47-ZM

Digi International

MODULE I.MX51 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,280

-

CC-9M-NA59-Z1

Digi International

MOD 9M 256MB SDRAM 512MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,536

ARM920T, SC2443

-

533MHz

512MB

256MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

M5475EFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,040

ColdFire V4e, MCF5475

-

266MHz

2MB (Boot)

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

0°C ~ 70°C

MOD5270BXCE

NXP

MOD NETBURNER MOD5270 100 UNITS

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Co-Processor: -
Speed: 95MHz
Flash Size: 512KB
RAM Size: 2.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,936

ColdFire 5270

-

95MHz

512KB

2.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

FS-372

Digi International

MODULE 32MB SDRAM 32MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2440
Co-Processor: -
Speed: 400MHz
Flash Size: 32MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -25°C ~ 75°C

封裝: -

庫存2,960

ARM920T, SC2440

-

400MHz

32MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-25°C ~ 75°C

FS-327

Digi International

MODULE DIMM52016MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,112

-

FS-662

Digi International

MODULE A9M2440 32MB SDRAM FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,448

-

FS-383

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,024

-

CENGLH7A400-10-402EC

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,680

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

TE0320-00-EV02

Trenz Electronic GmbH

SOM SPARTAN-3A 1800K 1333MB DDR

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A DSP
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 4MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,904

Spartan-3A DSP

Cypress EZ-USB FX2LP

100MHz

4MB

128MB

B2B

2.7" x 1.9" (68mm x 48mm)

0°C ~ 70°C

TE0741-03-160-2IF

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 160T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,568

Kintex-7 160T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-9P-T225-Z1

Digi International

MODULE 9P 32MB SDRAM 32MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,008

-

SOMDM3730-32-2880AKXR

Logic

SOM TORPEDO WIRELESS 1GHZ EXT

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 1GHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存7,608

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

1GHz

512MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

-40°C ~ 70°C

EZ80F917150MODG

Zilog

BOARD ZDOTS SBC Z80ACCLAIM PLUS

Module/Board Type: MCU, Ethernet Core
Core Processor: eZ80F91
Co-Processor: -
Speed: 50MHz
Flash Size: 256KB (Internal), 8MB (External)
RAM Size: 8KB (Internal), 512KB (External)
Connector Type: Header 2x30
Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,212

eZ80F91

-

50MHz

256KB (Internal), 8MB (External)

8KB (Internal), 512KB (External)

Header 2x30

2.5" x 3.1" (63.5mm x 78.7mm)

0°C ~ 70°C

DC-ME-01T-EBE-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,480

-

A10S-P9-X5E-RI-SA

Critical Link LLC

IC MODULE CORTEX-A9 1.2GHZ 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Arria 10 SX
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 6GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,296

ARM® Cortex®-A9, Arria 10 SX

NEON™ SIMD

1.2GHz

-

6GB

Board-to-Board (BTB)

4" x 4" (101.5mm x 101.5mm)

-40°C ~ 85°C

TE0803-03-3BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存7,840

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

ME-SA1-C6-7I-D10-R3

Enclustra FPGA Solutions

SOM CYCLONE V 5CSXFC6 1GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: -
Speed: 800MHz
Flash Size: 16GB
RAM Size: 1GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存33

ARM® Dual-Core Cortex-A9

-

800MHz

16GB

1GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

MCV-6DB

ARIES Embedded

SoM CycloneV SoC-FPGA

Module/Board Type: FPGA
Core Processor: ARM Cortex-A9 (Dual Core)
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: 360 Pin
Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A9 (Dual Core)

-

800MHz

4GB

1GB

360 Pin

2.910" L x 1.650" W (74.00mm x 42.00mm)

0°C ~ 70°C

TE0715-04-30-1IA

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0714-04-52I-7-B

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: FPGA
Core Processor: Artix-7 A50T
Co-Processor: Artix-7
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: -
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3

Artix-7 A50T

Artix-7

-

16MB

-

1.570" L x 1.180" W (40.00mm x 30.00mm)

-40°C ~ 85°C

TE0782-02-92I33FH

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Board-to-Board (BTB) Socket - 480

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

ME-XU1-15EG-2I-D12E-G1-R4-1

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0741-05-G2I-1-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Kintex-7 FPGA XC7K410T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

DC-V-H264-10B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0820-05-3BE81ML

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU3EG-1SFVC784E

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

2GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

MA5D4-20A0A051E

ARIES Embedded

SoM SAMA5D42

Module/Board Type: -
Core Processor: SAMA5D42
Co-Processor: -
Speed: 528MHz
Flash Size: 4GB (NAND)
RAM Size: 128MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -25°C ~ 85°C

封裝: -

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SAMA5D42

-

528MHz

4GB (NAND)

128MB

-

-25°C ~ 85°C

TE0835-02-TXE21-A

Trenz Electronic GmbH

RFSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53
Speed: 1.3GHz
Flash Size: 512MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E

ARM® Cortex®-A53

1.3GHz

512MB

4GB

Board-to-Board (BTB) Socket

3.543" L x 2.559" W (90.00mm x 65.00mm)

0°C ~ 85°C