Trenz Electronic GmbH 產品

TE0741-02-070-2IF

Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 70T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0712-02-35-2I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A35T-2I 1GB DDR3

• Module/Board Type: FPGA
• Core Processor: Artix-7 A35T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0630-01I

Trenz Electronic GmbH

SOM SPARTAN-6 1GB DDR3

• Module/Board Type: FPGA, USB Core
• Core Processor: Spartan-6 LX-45
• Co-Processor: Cypress EZ-USB FX2LP
• Speed: 100MHz
• Flash Size: 8MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0723-03

Trenz Electronic GmbH

SOM ARDUZYNQ 7Z10 USBOTG MICROSD

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7010)
• Speed: 12MHz
• Flash Size: 16MB
• RAM Size: 512MB
• Connector Type: B2B
• Size / Dimension: -
• Operating Temperature: 0°C ~ 70°C

封裝: -

TE0741-03-325-2IF

Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 325T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0820-02-02EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 1GB DDR4

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

TE0745-02-45-2IA

Trenz Electronic GmbH

SOM ZYNQ 1GB DDR3

• Module/Board Type: MCU, FPGA
• Core Processor: ARM® Cortex®-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec UFPS
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0803-02-04CG-1EB

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 256MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 256MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

TE0745-02-81C11-A

Trenz Electronic GmbH

SOM MIT XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM® Cortex®-A9
• Co-Processor: Zynq-7000 (Z-7035)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0715-04-52I33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7015)
• Speed: 125MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0813-01-3AE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0823-01-3PIU1F

Trenz Electronic GmbH

ICOBOARD

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
• Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
• Speed: -
• Flash Size: 128MB
• RAM Size: 1GB
• Connector Type: USB
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0808-05-9GI21-A

Trenz Electronic GmbH

USOM+ MPSOC ZYNQ USCALE FPGA

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0720-03-2IFA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0600-04-83I21-A

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA
• Core Processor: Xilinx Spartan™ 6 XC6SLX150-3FGG484I
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 512MB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0745-02-91C11-A

Trenz Electronic GmbH

SOM 1GB DDR3 XC7Z045-1FBG676C

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq XC7Z045-1FBG676C
• Co-Processor: -
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 70°C

封裝: -

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TE0741-04-G2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0745-02-91C31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0745-02-93E31-AK

Trenz Electronic GmbH

SOM WITH XILINX ZYNQ 7045-3E AND

• Module/Board Type: MPU Core
• Core Processor: Zynq™ 7045 SoC XC7Z045-3FFG676E
• Co-Processor: ARM Cortex-A9
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0745-03-72I31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7030-2I, 1 GBY

• Module/Board Type: MPU Core
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-2FBG676I
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0820-04-3BE21FL

Trenz Electronic GmbH

MOD MPSOC ZU3EG-1E 2GB DDR4 IND

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0808-04-06EG-1EK

Trenz Electronic GmbH

IC MOD SOM MPSOC

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0713-03-82C46-A

Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

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TE0712-02-72C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0600-03-72C21-A

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA Core
• Core Processor: Spartan-6 LX-100
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封裝: -

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TE0741-04-B2C-1-A

Trenz Electronic GmbH

IC MOD KINTEX-7 160T 200MHZ 32MB

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

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TE0820-04-3AE21FA

Trenz Electronic GmbH

MOD MPSOC ZU3CG-1E 2GB DDR4 IND

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0808-05-9GI21-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: 4 x 160 Pin
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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