Trenz Electronic GmbH 產品 | 黑森爾電子
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Trenz Electronic GmbH 產品

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TE0600-03B
Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-100
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存5,440
TE0710-02-35-2CF
Trenz Electronic GmbH

SOM ARTIX-7 35T 512 MBYTE DDR3

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A35T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存5,488
TE0711-01-100-2C
Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 100T USB 2C

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存3,568
TE0723-03M
Trenz Electronic GmbH

SOM ARDUZYNQ ZYNQ Z-7010

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: 12MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: -
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存4,064
TE0720-03-1CF-S
Trenz Electronic GmbH

STARTER KIT XILINX ZYNQ MICROSOM

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存6,192
TE0745-02-30-2IA
Trenz Electronic GmbH

SOM DDR3

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
庫存7,456
TE0808-04-09EG-2IE
Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL MIT ZYNQ U

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存4,928
TE0820-03-03EG-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
  • Operating Temperature: 0°C ~ 80°C
封裝: -
庫存4,688
TE0803-03-2AE11-A
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
庫存7,968
TE0712-02-82C36-AW
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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TE0813-02-2AE81-A
Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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TE0803-04-2AE11-A
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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TE0712-03-82C36-A
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
TE0600-04-52I11-M
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 16MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
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TE0782-02-045-2IC
Trenz Electronic GmbH

IC MODULE CORTEX

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
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TE0745-03-92I31-AK
Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-2I AND HE

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
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TE0720-03-61Q42NA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32GB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -
封裝: -
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TE0720-03-62I33GA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
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TE0821-01-3BI21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
  • Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: 2 x 160 Pin
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
TE0808-05-6BE21-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: 4 x 160 Pin
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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TE0630-02-52C12-A
Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
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TE0712-02-82I36-A
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
TE0821-01-3BE21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: 2 x 100 Pin
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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TE0808-04-BBE21-A
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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AM0010-02-4AE21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU4CG-1E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
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TE0745-03-71I31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
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TE0820-05-2AE81MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
TE0817-01-7DE21-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote