頁 46 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMOMAP3503-21-1670AGCR	Logic	SYSTEM ON MODULE LV OMAP3503 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,680	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	0°C ~ 70°C
CENGPXA270-520-10-550HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,320	PXA270	-	520MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0518	Digi International	MODULE RABBITCORE RCM3110 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 1.65" (47mm x 42mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,944	Rabbit 3000	-	29.4MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 1.65" (47mm x 42mm)	-40°C ~ 85°C
101-0507	Digi International	MODULE RABBITCORE RCM3000 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 30MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存6,976	Rabbit 3000	-	30MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
TE0720-03-L1IF	Trenz Electronic GmbH	SOM SOC 7Z020-L1CLG484I 512MB L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,528	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0720-03-2IFC3	Trenz Electronic GmbH	SOM SOC 7Z020-2CLG484I 1GB LOPRO Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,304	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0320-00-EV02I	Trenz Electronic GmbH	SOM SPARTAN-3A 1800K 1333MB DDR Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A DSP Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 4MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 2.7" x 1.9" (68mm x 48mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存2,096	Spartan-3A DSP	Cypress EZ-USB FX2LP	100MHz	4MB	128MB	B2B	2.7" x 1.9" (68mm x 48mm)	-40°C ~ 85°C
TE0710-02-100-2CF	Trenz Electronic GmbH	SOM ARTIX-7 100T 512 MBYTE DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,864	Artix-7 A100T	-	100MHz	32MB	512MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
DC-ME-01T-MF-VS	Digi International	MOD ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,784	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
CC-9P-V236-Z1	Digi International	MODULE 9P 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,640	-	-	-	-	-	-	-	-
20-101-0507	Digi International	MODULE RABBITCORE RCM3000 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 30MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存4,816	Rabbit 3000	-	30MHz	512KB	512KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
20-101-0383	Digi International	MODULE RABBITCORE RCM2020 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 18.432MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,752	Rabbit 2000	-	18.432MHz	256KB	128KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
SOMDM3730-11-2783IFCR	Logic	DM3730 SOM-LV TYPE III 256MB LPD Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,696	-	-	-	-	-	-	-	-
TE0803-02-04EV-1E3	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存3,488	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0741-05-B2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K160T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
ME-XU1-6EG-1I-D11E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I	600MHz, 1.5GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0823-01-3PIU1MA	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I	-	128MB	1GB	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
EC-VA-H264-10B-60-4K-OPVIC-0000	System-On-Chip (SOC) Technologies Inc.	ENCODER H264 4K VID/AUD 10BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0600-04-52I11-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX45-2FGG484I	-	125MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
5729-PX-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5729 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
TE0727-02-41C34	Trenz Electronic GmbH	ZYNQBERRYZERO MODULE WITH XILINX Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Co-Processor: - Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: USB Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Zynq™ XC7Z010-1CLG225C	-	-	16MB	512MB	USB	2.559" L x 1.181" W (65.00mm x 30.00mm)	0°C ~ 70°C
FORLINX-FET3568-C-202GSE16GCA10	Forlinx Embedded	Rockchip RK3568SOM, 2GB DDR4, 16 Module/Board Type: MPU Core Processor: ARM® Cortex®-A55 Co-Processor: - Speed: 2.0GHz Flash Size: 16GB eMMC RAM Size: 2GB Connector Type: Board-to-Board (BTB) Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm) Operating Temperature: 0°C ~ 80°C	封裝: -	Request a Quote	ARM® Cortex®-A55	-	2.0GHz	16GB eMMC	2GB	Board-to-Board (BTB)	1.770" L x 2.756" W (45.00mm x 70.00mm)	0°C ~ 80°C
DC-ME-Y413-AG	Digi	IC Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 8MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 1.450" L x 0.750" W (36.70mm x 19.10mm) Operating Temperature: -40°C ~ 75°C	封裝: -	Request a Quote	ARM926EJ-S, NS9210	-	75MHz	8MB	16MB	RJ45	1.450" L x 0.750" W (36.70mm x 19.10mm)	-40°C ~ 75°C
IW-G35M-11EG-4E004G-E008G-BIA	iWave Systems	ZU11EG (-1 speed) MPSoC SOM Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1) Co-Processor: ARM® Mali 400 MP2 Speed: 1.5GHz, 600MHz Flash Size: 8GB eMMC RAM Size: 4GB from PS, 4GB from PL Connector Type: 2 x 240 Pin, 2 x 240 Pin Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1)	ARM® Mali 400 MP2	1.5GHz, 600MHz	8GB eMMC	4GB from PS, 4GB from PL	2 x 240 Pin, 2 x 240 Pin	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C
TE0782-02-92I33FA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Board-to-Board (BTB) Socket - 480	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
TE0715-05-51I33-A	Trenz Electronic GmbH	IC SOC MODULE Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存36	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
SOMIMX8MMQ-11-2AE4SMCR	Beacon EmbeddedWorks	IC MOD I.MX 8M MINI 4GB Module/Board Type: MCU Core Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M4 Co-Processor: - Speed: 1.8GHz, 400MHz Flash Size: - RAM Size: 2GB Connector Type: USB Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM® Cortex™-A53, ARM® Cortex™-M4	-	1.8GHz, 400MHz	-	2GB	USB	1.100" L x 1.500" W (28.00mm x 38.00mm)	0°C ~ 70°C
EC-V-H264-8B-30-1080-MXC-SL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C

SOMOMAP3503-21-1670AGCR

Logic

SYSTEM ON MODULE LV OMAP3503

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,680

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB

128MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

0°C ~ 70°C

CENGPXA270-520-10-550HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 520MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,320

PXA270

-

520MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0518

Digi International

MODULE RABBITCORE RCM3110

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 1.65" (47mm x 42mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,944

Rabbit 3000

-

29.4MHz

256KB

128KB

2 IDC Headers 2x17

1.85" x 1.65" (47mm x 42mm)

-40°C ~ 85°C

101-0507

Digi International

MODULE RABBITCORE RCM3000

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 30MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存6,976

Rabbit 3000

-

30MHz

256KB

128KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

TE0720-03-L1IF

Trenz Electronic GmbH

SOM SOC 7Z020-L1CLG484I 512MB L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,528

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TE0720-03-2IFC3

Trenz Electronic GmbH

SOM SOC 7Z020-2CLG484I 1GB LOPRO

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,304

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TE0320-00-EV02I

Trenz Electronic GmbH

SOM SPARTAN-3A 1800K 1333MB DDR

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A DSP
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 4MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存2,096

Spartan-3A DSP

Cypress EZ-USB FX2LP

100MHz

4MB

128MB

B2B

2.7" x 1.9" (68mm x 48mm)

-40°C ~ 85°C

TE0710-02-100-2CF

Trenz Electronic GmbH

SOM ARTIX-7 100T 512 MBYTE DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,864

Artix-7 A100T

-

100MHz

32MB

512MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

DC-ME-01T-MF-VS

Digi International

MOD ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,784

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

CC-9P-V236-Z1

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,640

-

20-101-0507

Digi International

MODULE RABBITCORE RCM3000

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 30MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存4,816

Rabbit 3000

-

30MHz

512KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

20-101-0383

Digi International

MODULE RABBITCORE RCM2020

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 18.432MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,752

Rabbit 2000

-

18.432MHz

256KB

128KB

2 IDC Headers 2x20

1.9" x 2.3" (48.3mm x 58.4mm)

-40°C ~ 85°C

SOMDM3730-11-2783IFCR

Logic

DM3730 SOM-LV TYPE III 256MB LPD

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,696

-

TE0803-02-04EV-1E3

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存3,488

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0741-05-B2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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Xilinx Kintex-7 FPGA XC7K160T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

ME-XU1-6EG-1I-D11E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I

600MHz, 1.5GHz

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0823-01-3PIU1MA

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

128MB

1GB

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

EC-VA-H264-10B-60-4K-OPVIC-0000

System-On-Chip (SOC) Technologies Inc.

ENCODER H264 4K VID/AUD 10BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0600-04-52I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Spartan™ 6 XC6SLX45-2FGG484I

-

125MHz

16MB

128MB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

5729-PX-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5729 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

TE0727-02-41C34

Trenz Electronic GmbH

ZYNQBERRYZERO MODULE WITH XILINX

Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: USB
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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Zynq™ XC7Z010-1CLG225C

-

16MB

512MB

USB

2.559" L x 1.181" W (65.00mm x 30.00mm)

0°C ~ 70°C

FORLINX-FET3568-C-202GSE16GCA10

Forlinx Embedded

Rockchip RK3568SOM, 2GB DDR4, 16

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A55
Co-Processor: -
Speed: 2.0GHz
Flash Size: 16GB eMMC
RAM Size: 2GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm)
Operating Temperature: 0°C ~ 80°C

封裝: -

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ARM® Cortex®-A55

-

2.0GHz

16GB eMMC

2GB

Board-to-Board (BTB)

1.770" L x 2.756" W (45.00mm x 70.00mm)

0°C ~ 80°C

DC-ME-Y413-AG

Digi

IC

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 1.450" L x 0.750" W (36.70mm x 19.10mm)
Operating Temperature: -40°C ~ 75°C

封裝: -

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ARM926EJ-S, NS9210

-

75MHz

8MB

16MB

RJ45

1.450" L x 0.750" W (36.70mm x 19.10mm)

-40°C ~ 75°C

IW-G35M-11EG-4E004G-E008G-BIA

iWave Systems

ZU11EG (-1 speed) MPSoC SOM

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1)
Co-Processor: ARM® Mali 400 MP2
Speed: 1.5GHz, 600MHz
Flash Size: 8GB eMMC
RAM Size: 4GB from PS, 4GB from PL
Connector Type: 2 x 240 Pin, 2 x 240 Pin
Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1)

ARM® Mali 400 MP2

1.5GHz, 600MHz

8GB eMMC

4GB from PS, 4GB from PL

2 x 240 Pin, 2 x 240 Pin

4.330" L x 2.950" W (110.00mm x 75.00mm)

-40°C ~ 85°C

TE0782-02-92I33FA

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Board-to-Board (BTB) Socket - 480

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

TE0715-05-51I33-A

Trenz Electronic GmbH

IC SOC MODULE

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存36

ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

SOMIMX8MMQ-11-2AE4SMCR

Beacon EmbeddedWorks

IC MOD I.MX 8M MINI 4GB

Module/Board Type: MCU Core
Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M4
Co-Processor: -
Speed: 1.8GHz, 400MHz
Flash Size: -
RAM Size: 2GB
Connector Type: USB
Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM® Cortex™-A53, ARM® Cortex™-M4

-

1.8GHz, 400MHz

-

2GB

USB

1.100" L x 1.500" W (28.00mm x 38.00mm)

0°C ~ 70°C

EC-V-H264-8B-30-1080-MXC-SL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C