頁 47 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
100-1214-1	Bluetechnix GmbH	MODULE ECM-BF561-C-C-Q25S128F32 Module/Board Type: MPU Core Core Processor: CM-BF561 (Dual Core) Co-Processor: - Speed: 600MHz x 2 Flash Size: 32MB RAM Size: 128KB Connector Type: Expansion 2 x 100 Size / Dimension: 1.73" x 1.3" (44mm x 33mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,352	CM-BF561 (Dual Core)	-	600MHz x 2	32MB	128KB	Expansion 2 x 100	1.73" x 1.3" (44mm x 33mm)	0°C ~ 70°C
SOMDM3730-30-2780AKCR	Logic	SYSTEM ON MODULE TORP+ DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 1GHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,384	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	1GHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	0°C ~ 70°C
DC-ME-Y413-C	Digi International	MOD ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 16MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封裝: -	庫存2,400	ARM926EJ-S, NS9210	-	75MHz	16MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
SOMOMAP3530-10-1670EFCR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,456	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
20-101-1217	Digi International	MODULE RABBITCORE RCM3229 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,952	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 85°C
101-1055	Digi International	MODULE RABBIT CORE RCM3375 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,464	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
DC-EM-02T-NS-25	Digi International	EM 8MB SDRAM 4MB FLASH 25 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Pin Header Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,344	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	Pin Header	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
CC-MX-KD69-ZM-B	Digi International	MOD I.MX53 1GHZ 512MB FLASH 25PK Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 1GHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	封裝: -	庫存6,176	ARM? Cortex?-A8, i.MX53	-	1GHz	512MB	512MB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
CC-7U-Z111-Z1-B	Digi International	UMOD CONNECT 7U 16MB SDRAM 25PK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,400	ARM7TDMI, NS7520	-	55MHz	2MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
3354-HX-X38-RC	Critical Link LLC	MOD MITYSOM-3354 W/ AM3354 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3354 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,096	ARM? Cortex?-A8, AM3354	NEON SIMD	800MHz	512MB	512MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
TE0745-02-35-1C	Trenz Electronic GmbH	SOM MIT XILINX ZYNQ XC7Z035-1FBG Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,456	ARM? Cortex?-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
DC-ME-Y401-C	Digi International	ENCRYPTION ENGINE 10/100 INT Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封裝: -	庫存7,072	ARM926EJ-S, NS9210	-	75MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
DLP-232PC	DLP Design Inc.	MODULE USB-MCU FT232R W/18F2410 Module/Board Type: MCU, USB Core Core Processor: PIC18F2410 Co-Processor: FT232R Speed: 25MHz Flash Size: 16KB RAM Size: 768B Connector Type: USB - B, Pin Header Size / Dimension: 1.37" x 0.6" (34.8mm x 15.2mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,448	PIC18F2410	FT232R	25MHz	16KB	768B	USB - B, Pin Header	1.37" x 0.6" (34.8mm x 15.2mm)	0°C ~ 70°C
20-101-1321	Digi International	MODULE MINICORE RCM6760 Module/Board Type: MPU Core Core Processor: Rabbit 6000 Co-Processor: - Speed: 162.5MHz Flash Size: 4MB RAM Size: 1.032MB (Internal), 1MB (External) Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存11,304	Rabbit 6000	-	162.5MHz	4MB	1.032MB (Internal), 1MB (External)	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
DC-ME-01T-S	Digi International	ME 8MB SDRAM 2MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存8,292	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0745-02-30-2I	Trenz Electronic GmbH	SOM DDR3 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,160	-	-	-	-	-	-	-	-
TE0820-02-02CG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU2CG-1S 1GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,856	-	-	-	-	-	-	-	-
IW-G30M-C7EV-4E004G-E008G-BEA	iWave Systems	ZYNQ ULTRASCALE+ ZU7EV MPSOC SOM Module/Board Type: - Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 3.740" x 2.950" (94.99mm x 74.93mm) Operating Temperature: -20°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV	-	1.5GHz	-	-	-	3.740" x 2.950" (94.99mm x 74.93mm)	-20°C ~ 85°C
ME-XU9-4CG-1E-D11E-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 4CG REV2.1 Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
MYC-C7Z010-V2-4E1D-667-I	MYIR Tech Limited	System-On-Module, Zynq-7010 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 866MHz Flash Size: 4GB eMMC, 32MB QSPI RAM Size: 1GB Connector Type: Pin(s) Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7010)	866MHz	4GB eMMC, 32MB QSPI	1GB	Pin(s)	2.953" L x 2.165" W (75.00mm x 55.00mm)	-40°C ~ 85°C
TE0600-03-52I11-W	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
20-101-1142	Digi	20-101-1142 Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 4MB RAM Size: 512KB Connector Type: Header Size / Dimension: 1.850" L x 2.840" W (47.00mm x 72.00mm) Operating Temperature: -20°C ~ 85°C	封裝: -	Request a Quote	Rabbit 4000	-	58.98MHz	4MB	512KB	Header	1.850" L x 2.840" W (47.00mm x 72.00mm)	-20°C ~ 85°C
MYS-7Z010-V2-0E1D-667-C-S	MYIR Tech Limited	Zynq-7010 SBC, Z-turn Board V2 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: 667MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm) Operating Temperature: -	封裝: -	Request a Quote	ARM® Cortex®-A9	-	667MHz	-	-	-	4.016" x 2.480" (102.00mm x 63.00mm)	-
TE0813-01-4DE11-AZ	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0813-02-4DE81-A	Trenz Electronic GmbH	TE0813-02-4DE81-A STARTER KIT Module/Board Type: FPGA Core Processor: Zynq™ UltraScale+™ ZU4EV Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: BGA Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq™ UltraScale+™ ZU4EV	-	-	128MB	4GB	BGA	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
ME-XU1-9EG-2I-D12E-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0729-02-62I63FAK	Trenz Electronic GmbH	IC SOC MODULE ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	512MB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0808-05-6BE81-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-

100-1214-1

Bluetechnix GmbH

MODULE ECM-BF561-C-C-Q25S128F32

Module/Board Type: MPU Core
Core Processor: CM-BF561 (Dual Core)
Co-Processor: -
Speed: 600MHz x 2
Flash Size: 32MB
RAM Size: 128KB
Connector Type: Expansion 2 x 100
Size / Dimension: 1.73" x 1.3" (44mm x 33mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,352

CM-BF561 (Dual Core)

-

600MHz x 2

32MB

128KB

Expansion 2 x 100

1.73" x 1.3" (44mm x 33mm)

0°C ~ 70°C

SOMDM3730-30-2780AKCR

Logic

SYSTEM ON MODULE TORP+ DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 1GHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,384

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

1GHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

0°C ~ 70°C

DC-ME-Y413-C

Digi International

MOD ME 9210 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 16MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封裝: -

庫存2,400

ARM926EJ-S, NS9210

-

75MHz

16MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

SOMOMAP3530-10-1670EFCR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,456

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB

128MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

20-101-1217

Digi International

MODULE RABBITCORE RCM3229

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,952

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 85°C

101-1055

Digi International

MODULE RABBIT CORE RCM3375

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 32MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,464

Rabbit 3000

-

44.2MHz

512KB (Internal), 32MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

DC-EM-02T-NS-25

Digi International

EM 8MB SDRAM 4MB FLASH 25 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Pin Header
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,344

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

Pin Header

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

CC-MX-KD69-ZM-B

Digi International

MOD I.MX53 1GHZ 512MB FLASH 25PK

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 1GHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

封裝: -

庫存6,176

ARM? Cortex?-A8, i.MX53

-

1GHz

512MB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

CC-7U-Z111-Z1-B

Digi International

UMOD CONNECT 7U 16MB SDRAM 25PK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 16MB
Connector Type: 48-DIP
Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,400

ARM7TDMI, NS7520

-

55MHz

2MB

16MB

48-DIP

2.48" x 0.73" (62.9mm x 18.5mm)

0°C ~ 70°C

3354-HX-X38-RC

Critical Link LLC

MOD MITYSOM-3354 W/ AM3354

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3354
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,096

ARM? Cortex?-A8, AM3354

NEON SIMD

800MHz

512MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

TE0745-02-35-1C

Trenz Electronic GmbH

SOM MIT XILINX ZYNQ XC7Z035-1FBG

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,456

ARM? Cortex?-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

DC-ME-Y401-C

Digi International

ENCRYPTION ENGINE 10/100 INT

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封裝: -

庫存7,072

ARM926EJ-S, NS9210

-

75MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

DLP-232PC

DLP Design Inc.

MODULE USB-MCU FT232R W/18F2410

Module/Board Type: MCU, USB Core
Core Processor: PIC18F2410
Co-Processor: FT232R
Speed: 25MHz
Flash Size: 16KB
RAM Size: 768B
Connector Type: USB - B, Pin Header
Size / Dimension: 1.37" x 0.6" (34.8mm x 15.2mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,448

PIC18F2410

FT232R

25MHz

16KB

768B

USB - B, Pin Header

1.37" x 0.6" (34.8mm x 15.2mm)

0°C ~ 70°C

20-101-1321

Digi International

MODULE MINICORE RCM6760

Module/Board Type: MPU Core
Core Processor: Rabbit 6000
Co-Processor: -
Speed: 162.5MHz
Flash Size: 4MB
RAM Size: 1.032MB (Internal), 1MB (External)
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存11,304

Rabbit 6000

-

162.5MHz

4MB

1.032MB (Internal), 1MB (External)

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-40°C ~ 85°C

DC-ME-01T-S

Digi International

ME 8MB SDRAM 2MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存8,292

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0745-02-30-2I

Trenz Electronic GmbH

SOM DDR3

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,160

-

TE0820-02-02CG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2CG-1S 1GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,856

-

IW-G30M-C7EV-4E004G-E008G-BEA

iWave Systems

ZYNQ ULTRASCALE+ ZU7EV MPSOC SOM

Module/Board Type: -
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV
Co-Processor: -
Speed: 1.5GHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 3.740" x 2.950" (94.99mm x 74.93mm)
Operating Temperature: -20°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV

-

1.5GHz

-

3.740" x 2.950" (94.99mm x 74.93mm)

-20°C ~ 85°C

ME-XU9-4CG-1E-D11E-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 4CG REV2.1

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

MYC-C7Z010-V2-4E1D-667-I

MYIR Tech Limited

System-On-Module, Zynq-7010

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 866MHz
Flash Size: 4GB eMMC, 32MB QSPI
RAM Size: 1GB
Connector Type: Pin(s)
Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A9

Zynq-7000 (Z-7010)

866MHz

4GB eMMC, 32MB QSPI

1GB

Pin(s)

2.953" L x 2.165" W (75.00mm x 55.00mm)

-40°C ~ 85°C

TE0600-03-52I11-W

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

20-101-1142

Digi

20-101-1142

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 4MB
RAM Size: 512KB
Connector Type: Header
Size / Dimension: 1.850" L x 2.840" W (47.00mm x 72.00mm)
Operating Temperature: -20°C ~ 85°C

封裝: -

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Rabbit 4000

-

58.98MHz

4MB

512KB

Header

1.850" L x 2.840" W (47.00mm x 72.00mm)

-20°C ~ 85°C

MYS-7Z010-V2-0E1D-667-C-S

MYIR Tech Limited

Zynq-7010 SBC, Z-turn Board V2

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: 667MHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm)
Operating Temperature: -

封裝: -

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ARM® Cortex®-A9

-

667MHz

-

4.016" x 2.480" (102.00mm x 63.00mm)

-

TE0813-01-4DE11-AZ

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

TE0813-02-4DE81-A

Trenz Electronic GmbH

TE0813-02-4DE81-A STARTER KIT

Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ ZU4EV
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: BGA
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq™ UltraScale+™ ZU4EV

-

128MB

4GB

BGA

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

ME-XU1-9EG-2I-D12E-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0729-02-62I63FAK

Trenz Electronic GmbH

IC SOC MODULE ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

512MB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0808-05-6BE81-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-