頁 44 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
100-1217-1	Bluetechnix GmbH	MODULE ECM-BF609-C-C-Q25S256F8 Module/Board Type: MPU Core Core Processor: ADSP-BF609 (Dual Core) Co-Processor: - Speed: 500MHz x 2 Flash Size: 8MB RAM Size: 256KB Connector Type: Expansion 2 x 100 Size / Dimension: 1.73" x 1.3" (44mm x 33mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,952	ADSP-BF609 (Dual Core)	-	500MHz x 2	8MB	256KB	Expansion 2 x 100	1.73" x 1.3" (44mm x 33mm)	0°C ~ 70°C
CC-9M-NA37-Z1-B	Digi International	MOD 9M 64MB SDRAM 128MB FLASH 25 Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 128MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,504	ARM920T, SC2443	-	533MHz	128MB	64MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
SOMOMAP3530-11-1670EFCR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,792	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
M5485AFE	NXP	MODULE MCF5485 FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存2,656	ColdFire V4e, MCF5485	-	200MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	-40°C ~ 85°C
FS-3007	Digi International	MODULE 32MB SDRAM 32MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2440 Co-Processor: - Speed: 400MHz Flash Size: 32MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -25°C ~ 75°C	封裝: -	庫存2,944	ARM920T, SC2440	-	400MHz	32MB	32MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-25°C ~ 75°C
SOMLX800-11-000GCR-A	Logic	MODULE SOM LX800 GEODE WO/SODIMM Module/Board Type: MPU Core Core Processor: Geode, LX 800 Co-Processor: - Speed: 500MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 3.78" x 4.53" (96mm x 115mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,048	Geode, LX 800	-	500MHz	-	-	-	3.78" x 4.53" (96mm x 115mm)	0°C ~ 70°C
FS-364	Digi International	MODULE 9P 16MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,608	-	-	-	-	-	-	-	-
CC-9C-V237-Z6-B	Digi International	MODULE 9C 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 128MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,312	ARM926EJ-S, NS9360	-	155MHz	128MB	64MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
3352-HX-X38-RC	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 256MB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,080	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	256MB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CC-9P-V524-C	Digi International	CONNECTCORE 9P 9215 MODULE Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,232	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	-	-	-40°C ~ 85°C
SOMDM3730-10-1782JFIR	Logic	SYSTEM ON MODULE LV DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,384	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	-40°C ~ 85°C
L138-DX-225-RI	Critical Link LLC	MITYDSP-L138 W/ OMAP-L138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP) Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,392	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP)	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)	SO-DIMM-200	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
20-101-0488	Digi International	MODULE RABBITCORE RCM2210 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存7,236	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
OSD3358-512M-ICB	Octavo Systems LLC	AM3358 512MB DDR3L 4KB EEPROM TP Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: 4GB RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,344	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	-40°C ~ 85°C
TE0803-02-05EV-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存6,336	Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0807-02-07EV-1E	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存3,552	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0715-04-21C33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7012S) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7012S)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0715-05-52I33-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ XC7Z Module/Board Type: MPU Core Core Processor: Zynq™ 7015 XC7Z015-2CLG485I Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq™ 7015 XC7Z015-2CLG485I	ARM Cortex-A9	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-04-15-1IC	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
FORLINX-FET3588J-C-224GSE32GIA11	Forlinx Embedded	Rockchip RK3588J SOM,4GBLPDDR4x, Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU1-6CG-1E-D11E-G1-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6CG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E	600MHz, 1.5GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
MSMP157-BAA	ARIES Embedded	SOM ST32MP1 Module/Board Type: MPU Core Processor: ARM® Cortex®-A7, Dual-Core Co-Processor: ARM® Cortex®-M4F Speed: 800MHz Flash Size: 4GB eMMC, 128MB QSPI RAM Size: 1GB Connector Type: OSM Size M, 476 Contacts Size / Dimension: 1.770" L x 1.180" W (45.00mm x 30.00mm) Operating Temperature: -25°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A7, Dual-Core	ARM® Cortex®-M4F	800MHz	4GB eMMC, 128MB QSPI	1GB	OSM Size M, 476 Contacts	1.770" L x 1.180" W (45.00mm x 30.00mm)	-25°C ~ 85°C
TE0720-04-61Q33ML	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-9GI81-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TEM0007-01-CBD11-A	Trenz Electronic GmbH	MICROCHIP POLARFIRE SOC FPGA 95T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	封裝: -	Request a Quote	-	-	-	64MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-
SCM-20260E-B	GHI Electronics, LLC	SITCORE SCM20260E SOM Module/Board Type: MPU Core Core Processor: SITCore Co-Processor: - Speed: 480MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封裝: -	庫存1,776	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
TE0820-05-4BI21PLZ	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 64GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	64GB eMMC, 128MB QSPI	2GB	-	-	-
TE0820-03-4DE21FA	Trenz Electronic GmbH	IC MODULE 2GB 128MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-

100-1217-1

Bluetechnix GmbH

MODULE ECM-BF609-C-C-Q25S256F8

Module/Board Type: MPU Core
Core Processor: ADSP-BF609 (Dual Core)
Co-Processor: -
Speed: 500MHz x 2
Flash Size: 8MB
RAM Size: 256KB
Connector Type: Expansion 2 x 100
Size / Dimension: 1.73" x 1.3" (44mm x 33mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,952

ADSP-BF609 (Dual Core)

-

500MHz x 2

8MB

256KB

Expansion 2 x 100

1.73" x 1.3" (44mm x 33mm)

0°C ~ 70°C

CC-9M-NA37-Z1-B

Digi International

MOD 9M 64MB SDRAM 128MB FLASH 25

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,504

ARM920T, SC2443

-

533MHz

128MB

64MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

SOMOMAP3530-11-1670EFCR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: TMS320C64x (DSP)
Speed: 600MHz
Flash Size: 256MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,792

ARM? Cortex?-A8, OMAP3530

TMS320C64x (DSP)

600MHz

256MB

128MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

M5485AFE

NXP

MODULE MCF5485 FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5485
Co-Processor: -
Speed: 200MHz
Flash Size: 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存2,656

ColdFire V4e, MCF5485

-

200MHz

2MB (Boot)

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

-40°C ~ 85°C

FS-3007

Digi International

MODULE 32MB SDRAM 32MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2440
Co-Processor: -
Speed: 400MHz
Flash Size: 32MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -25°C ~ 75°C

封裝: -

庫存2,944

ARM920T, SC2440

-

400MHz

32MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-25°C ~ 75°C

SOMLX800-11-000GCR-A

Logic

MODULE SOM LX800 GEODE WO/SODIMM

Module/Board Type: MPU Core
Core Processor: Geode, LX 800
Co-Processor: -
Speed: 500MHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 3.78" x 4.53" (96mm x 115mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,048

Geode, LX 800

-

500MHz

-

3.78" x 4.53" (96mm x 115mm)

0°C ~ 70°C

FS-364

Digi International

MODULE 9P 16MB SDRAM 32MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,608

-

CC-9C-V237-Z6-B

Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,312

ARM926EJ-S, NS9360

-

155MHz

128MB

64MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

3352-HX-X38-RC

Critical Link LLC

MITYSOM-3352 W/ AM3352

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,080

ARM? Cortex?-A8, AM3352

NEON SIMD

800MHz

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

CC-9P-V524-C

Digi International

CONNECTCORE 9P 9215 MODULE

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,232

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

-

-40°C ~ 85°C

SOMDM3730-10-1782JFIR

Logic

SYSTEM ON MODULE LV DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,384

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB (NAND), 8MB (NOR)

256MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

-40°C ~ 85°C

L138-DX-225-RI

Critical Link LLC

MITYDSP-L138 W/ OMAP-L138

Module/Board Type: MPU, DSP Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP)
Speed: 375MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,392

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP)

375MHz

256MB (NAND), 8MB (NOR)

8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)

SO-DIMM-200

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

20-101-0488

Digi International

MODULE RABBITCORE RCM2210

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存7,236

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

OSD3358-512M-ICB

Octavo Systems LLC

AM3358 512MB DDR3L 4KB EEPROM TP

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: NEON™ SIMD
Speed: 1GHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: 400-BGA
Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,344

ARM® Cortex®-A8, AM3358

NEON™ SIMD

1GHz

4GB

512MB

400-BGA

1.06" x 1.06" (27.0mm x 27.0mm)

-40°C ~ 85°C

TE0803-02-05EV-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存6,336

Zynq UltraScale+ XCZU5EV-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0807-02-07EV-1E

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存3,552

Zynq UltraScale+ XCZU7EV-1FBVB900E

-

128MB

4GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0715-04-21C33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7012S)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7012S)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0715-05-52I33-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

Module/Board Type: MPU Core
Core Processor: Zynq™ 7015 XC7Z015-2CLG485I
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq™ 7015 XC7Z015-2CLG485I

ARM Cortex-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0715-04-15-1IC

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

FORLINX-FET3588J-C-224GSE32GIA11

Forlinx Embedded

Rockchip RK3588J SOM,4GBLPDDR4x,

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

ME-XU1-6CG-1E-D11E-G1-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6CG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E

600MHz, 1.5GHz

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

MSMP157-BAA

ARIES Embedded

SOM ST32MP1

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7, Dual-Core
Co-Processor: ARM® Cortex®-M4F
Speed: 800MHz
Flash Size: 4GB eMMC, 128MB QSPI
RAM Size: 1GB
Connector Type: OSM Size M, 476 Contacts
Size / Dimension: 1.770" L x 1.180" W (45.00mm x 30.00mm)
Operating Temperature: -25°C ~ 85°C

封裝: -

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ARM® Cortex®-A7, Dual-Core

ARM® Cortex®-M4F

800MHz

4GB eMMC, 128MB QSPI

1GB

OSM Size M, 476 Contacts

1.770" L x 1.180" W (45.00mm x 30.00mm)

-25°C ~ 85°C

TE0720-04-61Q33ML

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0808-05-9GI81-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TEM0007-01-CBD11-A

Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 95T

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -

封裝: -

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-

64MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-

SCM-20260E-B

GHI Electronics, LLC

SITCORE SCM20260E SOM

Module/Board Type: MPU Core
Core Processor: SITCore
Co-Processor: -
Speed: 480MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存1,776

SITCore

-

480MHz

16MB

32MB

-

-40°C ~ 85°C

TE0820-05-4BI21PLZ

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 64GB eMMC, 128MB QSPI
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

64GB eMMC, 128MB QSPI

2GB

-

TE0820-03-4DE21FA

Trenz Electronic GmbH

IC MODULE 2GB 128MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

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