Avago Technologies’ industrial-grade high-temperature (-40C to 115C), AEDT-981x three-channel optical incremental encoder modules. They offer a built-in interpolator circuit and enable high resolution in a compact module for motion-control applications.
Toshiba has unveiled its new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory – a structure stacking Flash memory cells vertically on a silicon substrate to realise significant density improvements over planar NAND Flash memory, where cells are formed on the silicon substrate.
Electronic devices are becoming ever more compact and densely packed with components, with this comes an increase in the possibility of malfunctions influencing circuit operation due to ion migration. In response, Murata has developed a water-repellent monolithic ceramic capacitor by applying an innovative surface treatment.
APEM’s new NVG-compatible LED indicators are compliant with MIL-STD-3009 and are rated for NVIS indication in cockpits and for external lighting.
New from Texas Instruments, the AMC1304 is a precision, delta-sigma (ΔΣ) modulator with the output separated from the input circuitry by a capacitive double isolation barrier that is highly resistant to magnetic interference.
The recently expanded BergStak connector product range is offering 0.5mm mezzanine connectors available in 3mm to 6mm stack height options in 0.5mm increments.
Freescale’s PF3000 power management integrated circuit (PMIC) features a configurable architecture that supports numerous outputs with various current ratings.
Microsemi announced availability of the smallest radio module it has ever produced. Measuring just 5.5mm x 4.5mm x 1.5mm, the ZL70323 is optimized for implantable medical devices such as pacemakers, cardiac defibrillators and neurostimulators.
The Analog Devices AD9152, a dual, 16-Bit TxDAC+ digital-to-analog converter (DAC) with a maximum sample rate of 2.25GSPS permits a multicarrier generation up to the Nyquist frequency.
The Texas Instruments (TI) ONET1130EC is a 2.5V integrated modulator driver and limiting amplifier with transmit and receive clock and data recovery (CDR) designed to operate between 9.8Gbps and 11.7Gbps without the need for a reference clock.
PHR series and TNPS series space-qualified resistors from Vishay. The devices benefit from very high reliability and proven thin-film technology.
Murata announces the successful development of what is believes is the world’s first surface-mount MEMS angular acceleration sensor.
Hirose has announced the development of a family of small, high-power connectors for use in industrial power supply and other power-demanding applications such as servers, medical devices and home electronics.
The HSFPAR Series force sensor has been developed by ALPS for force sensing in input devices and posture control in industrial equipment and robots, using MEMS technology to achieve the industry’s smallest size.
Cypress CY62 series asynchronous SRAMs, the company’s latest generation devices, integrate single-bit error correction capability and bit-interleaving techniques to mitigate the effects of soft errors.
Plessey has released its new range of MaGIC LED die, manufactured on the company’s patented GaN-on-Silicon technology.
Microsemi and Mikroprojekt, an IP design house specializing in FPGA IP cores and systems for display, video and graphics applications have announced the availability of Mikroprojekt’s compact and high-performance human machine interface (HMI) platform.
FCI’s new Griplet connector provides a robust solution for miniature IDC wire-to-board connections and has a low profile and compact design for easy installation where space is tight. It is designed for a stackable pitch up to twelve positions, with common housings available to protect and secure terminated components.