頁 42 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0725-02-35-2C	Trenz Electronic GmbH	SOM ARTIX-7 XC7A35T-2C FLASH Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,232	Artix-7 A35T	-	100MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
COMMPC8360-10-1652LCR	Logic	KIT 128MB DDR 8MB NOR 64MB NAND Module/Board Type: MPU Core Core Processor: PowerQUICC, MPC8360 Co-Processor: - Speed: 400MHz Flash Size: 64MB (NAND), 8MB (NOR) RAM Size: 128KB Connector Type: - Size / Dimension: 3.74" x 3.74" (95mm x 95mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,448	PowerQUICC, MPC8360	-	400MHz	64MB (NAND), 8MB (NOR)	128KB	-	3.74" x 3.74" (95mm x 95mm)	0°C ~ 70°C
CENGLH7A404-11-403EIR	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,288	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
FS-326	Digi International	MODULE DIMM520 2MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,496	-	-	-	-	-	-	-	-
101-0383	Digi International	MODULE RABBITCORE RCM2020 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 18.432MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,096	Rabbit 2000	-	18.432MHz	256KB	128KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
DXUD5290I	Dave Embedded Systems	SYSTEM ON MODULE I.MX6 2GB DDR3 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6 Dual Co-Processor: - Speed: 1GHz Flash Size: 512MB (NAND), 32MB (NOR) RAM Size: 2GB Connector Type: 3 x 140 Pins 0.6mm Pitch Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封裝: -	庫存2,576	ARM? Cortex?-A9, i.MX6 Dual	-	1GHz	512MB (NAND), 32MB (NOR)	2GB	3 x 140 Pins 0.6mm Pitch	-	-40°C ~ 85°C
CC-MX-L76C-Z1	Digi International	MOD WI-I.MX6 50 PCS PACK Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6DualLite Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存2,960	ARM? Cortex?-A9, i.MX6DualLite	-	800MHz	4GB	512MB	-	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
CC-9P-T225-Z1-B	Digi International	MODULE 9P 32MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,872	-	-	-	-	-	-	-	-
CC-9P-V513-LX-B	Digi International	MODULE 9P 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 16MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,184	ARM926EJ-S, NS9215	-	150MHz	8MB	16MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
TE0715-04-15-1I3	Trenz Electronic GmbH	SOM SOC 7Z015-1SBG485I 1GB LOPRO Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,200	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0725LP-01-100-2C	Trenz Electronic GmbH	SOM ARTIX-7 XC7A100T-2C FLASH Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 25MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,440	Artix-7 A100T	-	25MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
XRM57D843ZWTT	Texas Instruments	MODULE MCU ARM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,808	-	-	-	-	-	-	-	-
20-101-0404	Digi International	MODULE RABBITCORE RCM2000 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 25.8MHz Flash Size: 256KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,376	Rabbit 2000	-	25.8MHz	256KB	512KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
20-101-1305	Digi International	RCM3700 W/MOUNTING HOLES Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存16,908	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	512KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
TE0841-02-0401IL	Trenz Electronic GmbH	IC MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,952	-	-	-	-	-	-	-	-
TE0820-05-2AE21MAZ	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 8GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	8GB eMMC, 128MB QSPI	2GB	-	-	-
EC-VA-H264-10B-60-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H264 EN 60FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
TE0813-02-4BE81-A	Trenz Electronic GmbH	MODULE MPSOC 4GB DDR4 Module/Board Type: FPGA Core Processor: Xilinx Zynq UltraScale+ ZU4EG Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: BGA Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Xilinx Zynq UltraScale+ ZU4EG	-	-	128MB	2GB	BGA	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0782-02-82I33FA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Board-to-Board (BTB) Socket - 480	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
RK3328-SOM-1G	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: 1GB Connector Type: USB Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	-	1GB	USB	-	-
TE0722-03-41I-4-A	Trenz Electronic GmbH	IC MODULE CORTEX-A9 33MHZ 16MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0803-04-4DE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
MA-ZX2-10-2I-D9-R2	Enclustra FPGA Solutions	SOM ZYNQ 7Z010 512MB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 64MB RAM Size: 512MB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存168	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	64MB	512MB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0818-01-9GI21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0803-04-3AE11-AK	Trenz Electronic GmbH	MPSOC MODULE TE0803 WITH ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
2DC-VA-H264-10B-30-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H264 DE 30FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
TE0817-01-7AI21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7CG-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU7CG-1FBVB900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
MYS-7Z020-V2-0E1D-766-C	MYIR Tech Limited	Zynq-7020 SBC, Z-turn Kit V2 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: 667MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm) Operating Temperature: -	封裝: -	Request a Quote	ARM® Cortex®-A9	-	667MHz	-	-	-	4.016" x 2.480" (102.00mm x 63.00mm)	-

TE0725-02-35-2C

Trenz Electronic GmbH

SOM ARTIX-7 XC7A35T-2C FLASH

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,232

Artix-7 A35T

-

100MHz

32MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

0°C ~ 70°C

COMMPC8360-10-1652LCR

Logic

KIT 128MB DDR 8MB NOR 64MB NAND

Module/Board Type: MPU Core
Core Processor: PowerQUICC, MPC8360
Co-Processor: -
Speed: 400MHz
Flash Size: 64MB (NAND), 8MB (NOR)
RAM Size: 128KB
Connector Type: -
Size / Dimension: 3.74" x 3.74" (95mm x 95mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,448

PowerQUICC, MPC8360

-

400MHz

64MB (NAND), 8MB (NOR)

128KB

-

3.74" x 3.74" (95mm x 95mm)

0°C ~ 70°C

CENGLH7A404-11-403EIR

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,288

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

FS-326

Digi International

MODULE DIMM520 2MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,496

-

101-0383

Digi International

MODULE RABBITCORE RCM2020

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 18.432MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,096

Rabbit 2000

-

18.432MHz

256KB

128KB

2 IDC Headers 2x20

1.9" x 2.3" (48.3mm x 58.4mm)

-40°C ~ 85°C

DXUD5290I

Dave Embedded Systems

SYSTEM ON MODULE I.MX6 2GB DDR3

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A9, i.MX6 Dual
Co-Processor: -
Speed: 1GHz
Flash Size: 512MB (NAND), 32MB (NOR)
RAM Size: 2GB
Connector Type: 3 x 140 Pins 0.6mm Pitch
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存2,576

ARM? Cortex?-A9, i.MX6 Dual

-

1GHz

512MB (NAND), 32MB (NOR)

2GB

3 x 140 Pins 0.6mm Pitch

-

-40°C ~ 85°C

CC-MX-L76C-Z1

Digi International

MOD WI-I.MX6 50 PCS PACK

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A9, i.MX6DualLite
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存2,960

ARM? Cortex?-A9, i.MX6DualLite

-

800MHz

4GB

512MB

-

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

CC-9P-T225-Z1-B

Digi International

MODULE 9P 32MB SDRAM 32MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,872

-

CC-9P-V513-LX-B

Digi International

MODULE 9P 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,184

ARM926EJ-S, NS9215

-

150MHz

8MB

16MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

TE0715-04-15-1I3

Trenz Electronic GmbH

SOM SOC 7Z015-1SBG485I 1GB LOPRO

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,200

ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TE0725LP-01-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 XC7A100T-2C FLASH

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 25MHz
Flash Size: 32MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,440

Artix-7 A100T

-

25MHz

32MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

0°C ~ 70°C

XRM57D843ZWTT

Texas Instruments

MODULE MCU ARM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,808

-

20-101-0404

Digi International

MODULE RABBITCORE RCM2000

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 25.8MHz
Flash Size: 256KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,376

Rabbit 2000

-

25.8MHz

256KB

512KB

2 IDC Headers 2x20

1.9" x 2.3" (48.3mm x 58.4mm)

-40°C ~ 85°C

20-101-1305

Digi International

RCM3700 W/MOUNTING HOLES

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 512KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存16,908

Rabbit 3000

-

22.1MHz

512KB (Internal), 1MB (External)

512KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

-40°C ~ 70°C

TE0841-02-0401IL

Trenz Electronic GmbH

IC MODULE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,952

-

TE0820-05-2AE21MAZ

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 8GB eMMC, 128MB QSPI
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

8GB eMMC, 128MB QSPI

2GB

-

EC-VA-H264-10B-60-4K-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H264 EN 60FPS 4K SX660 SODIM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

TE0813-02-4BE81-A

Trenz Electronic GmbH

MODULE MPSOC 4GB DDR4

Module/Board Type: FPGA
Core Processor: Xilinx Zynq UltraScale+ ZU4EG
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: BGA
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

Request a Quote

Xilinx Zynq UltraScale+ ZU4EG

-

128MB

2GB

BGA

2.047" L x 2.992" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0782-02-82I33FA

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Board-to-Board (BTB) Socket - 480

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

RK3328-SOM-1G

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.5GHz
Flash Size: -
RAM Size: 1GB
Connector Type: USB
Size / Dimension: -
Operating Temperature: -

封裝: -

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ARM® Cortex®-A53

-

1.5GHz

-

1GB

USB

-

TE0722-03-41I-4-A

Trenz Electronic GmbH

IC MODULE CORTEX-A9 33MHZ 16MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0803-04-4DE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

MA-ZX2-10-2I-D9-R2

Enclustra FPGA Solutions

SOM ZYNQ 7Z010 512MB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: -
Flash Size: 64MB
RAM Size: 512MB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存168

ARM Cortex-A9

Zynq-7000 (Z-7010)

-

64MB

512MB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

-40°C ~ 85°C

TE0818-01-9GI21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU9EG-2FFVC900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

TE0803-04-3AE11-AK

Trenz Electronic GmbH

MPSOC MODULE TE0803 WITH ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU3CG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

2DC-VA-H264-10B-30-4K-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H264 DE 30FPS 4K SX660 SODIM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

TE0817-01-7AI21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7CG-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU7CG-1FBVB900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

MYS-7Z020-V2-0E1D-766-C

MYIR Tech Limited

Zynq-7020 SBC, Z-turn Kit V2

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: 667MHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm)
Operating Temperature: -

封裝: -

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ARM® Cortex®-A9

-

667MHz

-

4.016" x 2.480" (102.00mm x 63.00mm)

-