頁 41 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-325-2CF	Trenz Electronic GmbH	SOM KINTEX-7 325T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 325T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,064	Kintex-7 325T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
20-101-1315	Digi International	MODULE ETHERNET OP7400 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,072	-	-	-	-	-	-	-	-
20-101-1185	Digi International	MPU MODULE RABBIT 3000 TWO PACK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,160	-	-	-	-	-	-	-	-
20-101-0080	Digi International	CORE MODULE CM7110 Module/Board Type: MPU Core Core Processor: Z180 Co-Processor: - Speed: 9.216MHz Flash Size: 512KB EPROM RAM Size: 128KB Connector Type: 40 Pin Header Size / Dimension: 1.8" x 2.05" (46mm x 52mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存4,944	Z180	-	9.216MHz	512KB EPROM	128KB	40 Pin Header	1.8" x 2.05" (46mm x 52mm)	-40°C ~ 70°C
MOD5272-100CR	NetBurner Inc.	PROCESSOR MODULE FLASH Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5272 Co-Processor: - Speed: 62MHz Flash Size: 2MB RAM Size: 8.004MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,824	ColdFire 5272	-	62MHz	2MB	8.004MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
CENGPXA270-520-10-504HC	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,096	PXA270	-	520MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CC-WMX-L76C-TE	Digi International	CONNECTCORE 6 MODULE, I.MX6DUALL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,040	-	-	-	-	-	-	-	-
TE0710-02-100-2IF	Trenz Electronic GmbH	SOM ARTIX-7 100T 512 MBYTE DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,424	Artix-7 A100T	-	100MHz	32MB	512MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
100-1215-1	Bluetechnix GmbH	MODULE ECM-BF561-C-I-Q25S128F32 Module/Board Type: MPU Core Core Processor: CM-BF561 (Dual Core) Co-Processor: - Speed: 600MHz x 2 Flash Size: 32MB RAM Size: 128KB Connector Type: Expansion 2 x 100 Size / Dimension: 1.73" x 1.3" (44mm x 33mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,744	CM-BF561 (Dual Core)	-	600MHz x 2	32MB	128KB	Expansion 2 x 100	1.73" x 1.3" (44mm x 33mm)	-40°C ~ 85°C
100-1241-1	Bluetechnix GmbH	CORE MOD CM-BF548 600MHZ Module/Board Type: MPU Core Core Processor: CM-BF548 Co-Processor: - Speed: 533MHz Flash Size: 8MB RAM Size: 64MB Connector Type: Expansion 2 x 100 Size / Dimension: 1.22" x 1.61" (31mm x 41mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,248	CM-BF548	-	533MHz	8MB	64MB	Expansion 2 x 100	1.22" x 1.61" (31mm x 41mm)	-40°C ~ 85°C
SOMDM3730-32-1880AKIR	Logic	SOM TORPEDO WIRELESS 800MHZ IND Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,464	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	-40°C ~ 85°C
SOMDM3730-20-1780AGIR-D	Logic	SYSTEM ON MODULE TORP DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,032	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
CC-9P-V502-C	Digi International	MODULE 9P 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存11,208	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
DC-ME4-01T-CC-1	Digi International	MODULE CONNECTCORE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存2,608	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-ME9-01-C	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,520	-	-	-	-	-	-	-	-
TE0745-02-35-1CA	Trenz Electronic GmbH	SOM MIT XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,240	ARM® Cortex®-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
TE0808-04-09EG-1EE	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODUL 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存7,616	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
XPD1001000-01	Lantronix, Inc.	XPORT DIRECT+ DEVICE SERVER MODU Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,584	-	-	-	-	-	-	-	-
TE0782-02-A2I33MA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7100) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7100)	-	32MB	1GB	Board-to-Board (BTB) Socket	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
A20-SOM-N8GB	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1GHz Flash Size: 8GB RAM Size: 1GB Connector Type: 40 Pin Size / Dimension: 3.200" L x 2.200" W (81.28mm x 55.88mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM® Cortex®-A7	-	1GHz	8GB	1GB	40 Pin	3.200" L x 2.200" W (81.28mm x 55.88mm)	0°C ~ 70°C
CC-ST-DW69-ZM	Digi	STM32MP157DUAL GPU 512M SLC NAND Module/Board Type: MPU Core Processor: STM32MP157C Co-Processor: Arm® Dual Cortex®-A7, ARM® Cortex®-M4 Speed: 650MHz, 209MHz Flash Size: 512MB (Boot) RAM Size: 512MB Connector Type: Pin(s) Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存99	STM32MP157C	Arm® Dual Cortex®-A7, ARM® Cortex®-M4	650MHz, 209MHz	512MB (Boot)	512MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
2EC-VA-H264-10B-30-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H264 EN 30FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
TE0711-01-100-3E	Trenz Electronic GmbH	IC MOD ARTIX-7 A100T 100MHZ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0803-04-5DE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
MA-XU3-2CG-1E-D10-R3	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU2CG 1GB Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.33GHz Flash Size: 64MB RAM Size: 1GB Connector Type: Header, SO-DIMM, USB Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存150	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.33GHz	64MB	1GB	Header, SO-DIMM, USB	2.660" L x 1.180" W (67.60mm x 30.00mm)	0°C ~ 85°C
MA-AX3-35-1I-D8-R3	Enclustra FPGA Solutions	SOM ARTIX-7 7A35T 256MB Module/Board Type: FPGA Core Core Processor: Artix-7 A35T Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 256MB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存108	Artix-7 A35T	-	-	64MB	256MB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
A13-SOM-256	Olimex LTD	IC MODULE CORTEX-A13 1GHZ 256MB Module/Board Type: MCU Core Core Processor: Allwinner ARM® Cortex®-A8 Co-Processor: - Speed: 1GHz Flash Size: - RAM Size: 256MB Connector Type: - Size / Dimension: 2.400" L x 3.100" W (61.00mm x 78.70mm) Operating Temperature: -	封裝: -	Request a Quote	Allwinner ARM® Cortex®-A8	-	1GHz	-	256MB	-	2.400" L x 3.100" W (61.00mm x 78.70mm)	-
OSD32MP153A-512M-IAA	Octavo Systems LLC	SIP: 153A, 512MB, IAA Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz	-	512MB	302-BGA	0.710" L x 0.710" W (18.00mm x 18.00mm)	-40°C ~ 85°C

TE0741-02-325-2CF

Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 325T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,064

Kintex-7 325T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

20-101-1315

Digi International

MODULE ETHERNET OP7400

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,072

-

20-101-1185

Digi International

MPU MODULE RABBIT 3000 TWO PACK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,160

-

20-101-0080

Digi International

CORE MODULE CM7110

Module/Board Type: MPU Core
Core Processor: Z180
Co-Processor: -
Speed: 9.216MHz
Flash Size: 512KB EPROM
RAM Size: 128KB
Connector Type: 40 Pin Header
Size / Dimension: 1.8" x 2.05" (46mm x 52mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存4,944

Z180

-

9.216MHz

512KB EPROM

128KB

40 Pin Header

1.8" x 2.05" (46mm x 52mm)

-40°C ~ 70°C

MOD5272-100CR

NetBurner Inc.

PROCESSOR MODULE FLASH

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5272
Co-Processor: -
Speed: 62MHz
Flash Size: 2MB
RAM Size: 8.004MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,824

ColdFire 5272

-

62MHz

2MB

8.004MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

CENGPXA270-520-10-504HC

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 520MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,096

PXA270

-

520MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CC-WMX-L76C-TE

Digi International

CONNECTCORE 6 MODULE, I.MX6DUALL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,040

-

TE0710-02-100-2IF

Trenz Electronic GmbH

SOM ARTIX-7 100T 512 MBYTE DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,424

Artix-7 A100T

-

100MHz

32MB

512MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

100-1215-1

Bluetechnix GmbH

MODULE ECM-BF561-C-I-Q25S128F32

Module/Board Type: MPU Core
Core Processor: CM-BF561 (Dual Core)
Co-Processor: -
Speed: 600MHz x 2
Flash Size: 32MB
RAM Size: 128KB
Connector Type: Expansion 2 x 100
Size / Dimension: 1.73" x 1.3" (44mm x 33mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,744

CM-BF561 (Dual Core)

-

600MHz x 2

32MB

128KB

Expansion 2 x 100

1.73" x 1.3" (44mm x 33mm)

-40°C ~ 85°C

100-1241-1

Bluetechnix GmbH

CORE MOD CM-BF548 600MHZ

Module/Board Type: MPU Core
Core Processor: CM-BF548
Co-Processor: -
Speed: 533MHz
Flash Size: 8MB
RAM Size: 64MB
Connector Type: Expansion 2 x 100
Size / Dimension: 1.22" x 1.61" (31mm x 41mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,248

CM-BF548

-

533MHz

8MB

64MB

Expansion 2 x 100

1.22" x 1.61" (31mm x 41mm)

-40°C ~ 85°C

SOMDM3730-32-1880AKIR

Logic

SOM TORPEDO WIRELESS 800MHZ IND

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,464

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

-40°C ~ 85°C

SOMDM3730-20-1780AGIR-D

Logic

SYSTEM ON MODULE TORP DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,032

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

-40°C ~ 85°C

CC-9P-V502-C

Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存11,208

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

DC-ME4-01T-CC-1

Digi International

MODULE CONNECTCORE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存2,608

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-ME9-01-C

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,520

-

TE0745-02-35-1CA

Trenz Electronic GmbH

SOM MIT XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,240

ARM® Cortex®-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

TE0808-04-09EG-1EE

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存7,616

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

XPD1001000-01

Lantronix, Inc.

XPORT DIRECT+ DEVICE SERVER MODU

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,584

-

TE0782-02-A2I33MA

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7100)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7100)

-

32MB

1GB

Board-to-Board (BTB) Socket

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

A20-SOM-N8GB

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1GHz
Flash Size: 8GB
RAM Size: 1GB
Connector Type: 40 Pin
Size / Dimension: 3.200" L x 2.200" W (81.28mm x 55.88mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM® Cortex®-A7

-

1GHz

8GB

1GB

40 Pin

3.200" L x 2.200" W (81.28mm x 55.88mm)

0°C ~ 70°C

CC-ST-DW69-ZM

Digi

STM32MP157DUAL GPU 512M SLC NAND

Module/Board Type: MPU
Core Processor: STM32MP157C
Co-Processor: Arm® Dual Cortex®-A7, ARM® Cortex®-M4
Speed: 650MHz, 209MHz
Flash Size: 512MB (Boot)
RAM Size: 512MB
Connector Type: Pin(s)
Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存99

STM32MP157C

Arm® Dual Cortex®-A7, ARM® Cortex®-M4

650MHz, 209MHz

512MB (Boot)

512MB

Pin(s)

1.142" L x 1.142" W (29.00mm x 29.00mm)

-40°C ~ 85°C

2EC-VA-H264-10B-30-4K-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H264 EN 30FPS 4K SX660 SODIM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

TE0711-01-100-3E

Trenz Electronic GmbH

IC MOD ARTIX-7 A100T 100MHZ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0803-04-5DE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU5EV-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

MA-XU3-2CG-1E-D10-R3

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU2CG 1GB

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.33GHz
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Header, SO-DIMM, USB
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存150

ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.33GHz

64MB

1GB

Header, SO-DIMM, USB

2.660" L x 1.180" W (67.60mm x 30.00mm)

0°C ~ 85°C

MA-AX3-35-1I-D8-R3

Enclustra FPGA Solutions

SOM ARTIX-7 7A35T 256MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 256MB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存108

Artix-7 A35T

-

64MB

256MB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

-40°C ~ 85°C

A13-SOM-256

Olimex LTD

IC MODULE CORTEX-A13 1GHZ 256MB

Module/Board Type: MCU Core
Core Processor: Allwinner ARM® Cortex®-A8
Co-Processor: -
Speed: 1GHz
Flash Size: -
RAM Size: 256MB
Connector Type: -
Size / Dimension: 2.400" L x 3.100" W (61.00mm x 78.70mm)
Operating Temperature: -

封裝: -

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Allwinner ARM® Cortex®-A8

-

1GHz

-

256MB

-

2.400" L x 3.100" W (61.00mm x 78.70mm)

-

OSD32MP153A-512M-IAA

Octavo Systems LLC

SIP: 153A, 512MB, IAA

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz

-

512MB

302-BGA

0.710" L x 0.710" W (18.00mm x 18.00mm)

-40°C ~ 85°C